Patent Assignment
Reel/Frame 059887/0313
Assignment of Assignor's Interest
Recorded: 2022-05-11
Pages: 3
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Film-Like Adhesive and Method for Evaluating Ease of Splitting, Dicing/Die-Bonding Integrated Film and Method for Manufacturing, and Semiconductor Device
Application:
17/771,020 →
Publication:
US 2023/0005782
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.