Lead-free low-melting glass composition and low-melting glass composite material and low-melting glass paste containing lead-free low-melting glass composition, and sealing structure, electrical and electronic part and coated part using same

1 . A lead-free low-melting glass composition containing:

vanadium oxide;

tellurium oxide;

silver oxide; and

lithium oxide,

said composition satisfying the following two relational expressions (1) and (2) in terms of oxides:

[Ag 2 O]≥[TeO 2 ]≥[V 2 O 5 ]≥[Li 2 O]  (1)

2[V 2 O 5 ]≥[Ag 2 O]+[Li 2 O]≥40  (2)

(In the formula, [X] represents a content of component X, and the unit thereof is “mol % “; the same applies hereinafter).

2 . The lead-free low-melting glass composition according to claim 1 ,

wherein the following relation (3) is satisfied:

[V 2 O 5 ]+[TeO 2 ]+[Ag 2 O]+[Li 2 O]≥90  (3).

3 . The lead-free low-melting glass composition according to claim 1 ,

wherein the following relation (4) is satisfied:

3≥[Li 2 O]≥25  (4).

4 . The lead-free low-melting glass composition according to claim 1 ,

wherein the following relation (5) is satisfied:

5≥[Li 2 O]≥15  (5).

5 . The lead-free low-melting glass composition according to claim 1 ,

wherein the following three relational expressions (6) to (8) are satisfied:

20≥[V 2 O 5 ]≥30  (6)

24≥[TeO 2 ]≥35  (7)

24≥[Ag 2 O]≥42  (8).

6 . The lead-free low-melting glass composition according to claim 1 ,

further containing one or more of yttrium oxide, lanthanum oxide, cerium oxide, erbium oxide, ytterbium oxide, aluminum oxide and iron oxide,

wherein the following relation (9) is satisfied:

0.5≤[Y 2 O 3 ]+[La 2 O 3 ]+[CeO 2 ]+[Er 2 O 3 ]+[Yb 2 O 3 ]+[Al 2 O 3 ]+[Fe 2 O 3 ]≤3   (9).

7 . The lead-free low-melting glass composition according to claim 1 ,

further containing one or more of an oxide of an alkaline earth metal, tungsten oxide and molybdenum oxide,

wherein the following relation (10) is satisfied:

0.5≤[MgO]+[CaO]+[SrO]+[BaO]+[WO 3 ]+[MoO 3 ]≤5   (10).

8 . The lead-free low-melting glass composition according to claim 1

wherein a second endothermic peak temperature by a differential thermal analysis was 220° C. or lower,

a crystallization temperature by the differential thermal analysis was 260° C. or higher, and

a difference between the crystallization temperature and the second endothermic peak temperature is 60° C. or more.

9 . A low-melting glass composite material comprising:

the lead-free low-melting glass composition according to claim 1 ; and

one or more of low thermal expansion filler particles, metal particles and a resin.

10 . The low-melting glass composite material according to claim 9 ,

wherein a content of the lead-free low-melting glass composition is 35% by volume or more and less than 100% by volume,

wherein a content of the low thermal expansion filler particles is more than 0% by volume and 65% by volume or less.

11 . The low-melting glass composite material according to claim 10 ,

wherein the low thermal expansion filler particles include one or more of zirconium tungstate phosphate (Zr 2 (WO 4 )(PO 4 ) 2 ), β-eucryptite (Li 2 O·Al 2 O 3 ·2SiO 2 ), cordierite (2MgO·2Al 2 O 3 ·5SiO 2 ), quartz glass (SiO 2 ), niobium oxide (Nb 2 O 5 ), and silicon (Si).

12 . The low-melting glass composite material according to claim 10 ,

wherein the low thermal expansion filler particles are zirconium tungstate phosphate (Zr 2 (WO 4 )(PO 4 ) 2 ) or a compound mainly composed of zirconium tungstate phosphate (Zr 2 (WO 4 )(PO 4 ) 2 ),

wherein a content of the low thermal expansion filler particles is 30% by volume or more and 60% by volume or less.

13 . The low-melting glass composite material according to claim 9 ,

wherein a content of the lead-free low-melting glass composition is 10% by volume or more and 80% by volume or less, and

a content of the metal particles is 20% by volume or more and 90% by volume or less.

14 . The low-melting glass composite material according to claim 9 ,

wherein the metal particles include one or more of gold (Au), silver (Ag), silver alloy, copper (Cu), copper alloy, aluminum (Al), aluminum alloy, tin (Sn) and tin alloy.

15 . The low-melting glass composite material according to claim 14 ,

wherein the metal particles include silver (Ag) or tin (Sn), and

a content of the metal particles is 30% by volume or more and 90% by volume or less.

16 . The low-melting glass composite material according to claim 9 ,

wherein a content of the lead-free low-melting glass composition is 5% by volume or more and less than 100% by volume, and

a content of the resin is more than 0% by volume and 95% by volume or less.

17 . The low-melting glass composite material according to claim 9 ,

wherein the resin includes one or more of an epoxy resin, a phenoxy resin, a phenolic resin, an acrylic resin, a urethane resin and a fluororesin.

18 . A low-melting glass paste comprising:

the low-melting glass composite material according to claim 9 ; and

a solvent.

19 . The low-melting glass paste according to claim 18 ,

wherein the solvent contains dihydroterpineol, a-terpineol or carbitol acetate.

20 . A sealing structure comprising:

a sealed part which is formed using the low-melting glass composite material according to claim 9 and constitutes at least a part of a boundary between an inner space separated from an outside and the outside.

21 . An electrical and electronic part comprising:

an electrode, a wiring, a conductive joint, or a heat dissipation joint which is formed using the low-melting glass composite material according to claim 13 .

22 . A coated part comprising:

a member; and

a coating film formed on the member,

wherein the coating film includes the low-melting glass composite material according to claim 9 .

23 . The coated part according to claim 22 ,

wherein the member includes a base material of a metal, ceramic or glass.