Patent Assignment
Reel/Frame 059120/0023
Assignment of Assignor's Interest
Recorded: 2022-02-28
Pages: 6
Assignors
NAITO, TAKASHI
Executed: 2022-02-03
TACHIZONO, SHINICHI
Executed: 2022-02-15
HASHIBA, YUJI
Executed: 2022-02-06
MIYAKE, TATSUYA
Executed: 2022-02-03
ONODERA, TAIGO
Executed: 2022-02-04
AOYAGI, TAKUYA
Executed: 2022-02-03
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Lead-Free Low-Melting Glass Composition and Low-Melting Glass Composite Material and Low-Melting Glass Paste Containing Lead-Free Low-Melting Glass Composition, and Sealing Structure, Electrical and Electronic Part and Coated Part Using Same
Application:
17/638,308 →
Publication:
US 2022/0289621
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.