Patent Assignment
Reel/Frame 062992/0805
Change of Name
Recorded: 2023-03-08
Pages: 15
Assignor
SHOWA DENKO MATERIALS CO., LTD.
Executed: 2023-01-01
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Properties
(163)
Modified Silicone Compound, and Thermosetting Resin Composition, Prepreg, Laminate Plate and Printed Wiring Board Using Same
Epoxy Resin Composition and Electronic Component Device
Negative Electrode Material for Lithium Ion Secondary Battery, Negative Electrode for Lithium Ion Secondary Battery, and Lithium Ion Secondary Battery
Photosensitive Element, Laminate, Permanent Mask Resist, Method for Producing Same, and Method for Producing Semiconductor Package
Resin Varnish, Prepreg, Laminate, and Printed Wiring Board
Thermosetting Resin Composition and Its Production Method, Prepreg, Laminate, and Printed Wiring Board
Epoxy Resin, Epoxy Resin Composition, Inorganic Filler-Containing Epoxy Resin Composition, Resin Sheet, Cured Product, and Epoxy Compound
Resin Composition, Support with Resin Layer, Prepreg, Laminate, Multilayered Printed Wiring Board, and Printed Wiring Board for Millimeter-Wave Radar
Resin Composition, Prepreg, Laminate and Multilayer Printed Wiring Board
Method for Producing Frp Precursor and Device for Producing Same
Adhesive Composition, Cured Article, Semiconductor Device, and Production Method for Same
Multilayer Printed Wiring Board Production Method, Adhesive Layer-Equipped Metal Foil, Metal-Clad Laminate, and Multilayer Printed Wiring Board
Aerogel Laminated Composite and Thermal Insulation Material
Copper Paste for Joining, Method for Manufacturing Joined Body, and Method for Manufacturing Semiconductor Device
Polishing Liquid, Polishing Liquid Set, and Substrate Polishing Method
Polyamideimide Resin and Coating Material
Negative Electrode Material for Lithium Ion Secondary Battery, Negative Electrode for Lithium Ion Secondary Battery, and Lithium Ion Secondary Battery
Method for Producing Semiconductor Device
Multilayer Transmission Line Plate
Prepreg, Printed Circuit Board, Semiconductor Package, and Method for Producing Printed Circuit Board
Resin Sheet and Cured Product of Resin Sheet
Epoxy Resin Molding Material, Molded Product, Molded Cured Product, and Method for Producing Molded Cured Product
Sol Composition, Aerogel Composite, Support Member Provided with Aerogel Composite, and Heat Insulator
Aerogel Composite Powder
Liquid Epoxy Resin Composition for Sealing, and Electronic Component Device
Frictional Material Composition, Frictional Material. and Friction Member
Frictional Material Composition, Frictional Material, and Friction Member
Metal-Clad Laminate, Printed Wiring Board and Semiconductor Package
Thermosetting Resin Composition, Prepreg, Laminated Board, Printed Wiring Board, and High-Speed Communication-Compatible Module
Resin Composition, Resin Film, Laminate, Multilayer Printed Wiring Board and Method for Producing Multilayer Printed Wiring Board
Composite Film for Electronic Devices Using High Frequency Band Signals, Printed Wiring Board and Manufacturing Method Therefor
Resin Composition, Resin Layer-Provided Support, Prepreg, Laminate Sheet, Multilayer Printed Wiring Board, and Printed Wiring Board for Millimeter-Wave Radar
Resin Composition, Laminate Sheet, and Multilayer Printed Wiring Board
Interlayer Insulating Film and Method for Producing Same
Adhesive Composition
Composition, Hole Transport Material Composition, and Ink Composition
Electroconductive Film, Roll, Connected Structure, and Process for Producing Connected Structure
Resin Member and Sheet Using Same, Method for Producing Resin Member, and Heat Storage Material and Heat Control Sheet Using Same
Sealing Resin Composition, Electronic Component Device, and Method of Manufacturing Electronic Component Device
Organic Electronic Material, Organic Layer, Organic Electronic Element, Organic Electroluminescent Element, Display Element, Illumination Device, and Display Device
Printed Wiring Board and Semiconductor Package
Conductor Substrate, Wiring Substrate and Method for Producing Wiring Substrate
Aerogel Laminate and Thermal Insulation Material
Lead-Free Glass Composition, and Glass Composite Material, Glass Paste, and Sealing Structure Body Containing the Same
Method for Producing Semiconductor Device
Stretchable Member with Metal Foil
Negative Electrode Material for Lithium Ion Secondary Battery, Negative Electrode for Lithium Ion Secondary Battery, and Lithium Ion Secondary Battery
Copper Paste for Pressureless Bonding, Bonded Body and Semiconductor Device
Polishing Liquid and Polishing Method
Charge-Transport Material and Utilization Thereof
Prepreg, Laminate, Printed Wiring Board, Coreless Substrate, Semiconductor Package and Method for Producing Coreless Substrate
Adhesive Film
Adhesive Film
Resin for Energy Device Electrode, Composition for Forming Energy Device Electrode, Energy Device Electrode, and Energy Device
Organic Electronic Material and Use of Same
Polishing Agent, Stock Solution for Polishing Agent, and Polishing Method
Metal Paste for Joints, Assembly, Production Method for Assembly, Semiconductor Device, and Production Method for Semiconductor Device
Metal Paste for Joints, Assembly, Production Method for Assembly, Semiconductor Device, and Production Method for Semiconductor Device
Method for Manufacturing Frp Precursor and Method for Manufacturing Frp
Polishing Liquid, Polishing Liquid Set, and Polishing Method
Adhesive Composition
Friction Member, Friction Material Composition, Friction Material, and Vehicle
Temporary Protective Film for Semiconductor Sealing Molding
Resin Composition, Heat Storage Material, and Commodity
Organic Electronics Material and Organic Electronics Element
Semiconductor Element Mounting Structure, and Combination of Semiconductor Element and Substrate
Thermosetting Resin Composition, Prepreg, Laminate and Multilayer Printed Wiring Board
Resin Composition and Method of Producing Laminate
Production Method for Aerogel Laminate, and Aerogel Laminate Roll
Resin Composition, Cured Product, Formed Body and Manufacturing Method Thereof, and Film Capacitor and Manufacturing Method Thereof
Method for Producing Joined Body, and Joining Material
Composition Containing Organic Solvents with Different Vapor Pressures, Conductor Made from Composition, Method for Manufacturing Conductor, and Structure Comprising Conductor
Resin Film, and Laminated Film Including Base Material Film, Resin Film Formed on Base Material Film, and Protective Film Attached to Resin Film
Sol Composition
Connection Structure and Method for Producing Same
Member Connection Method and Adhesive Tape
Negative Electrode Active Material for Lithium Ion Secondary Battery, Negative Electrode for Lithium Ion Secondary Battery, and Lithium Ion Secondary Battery
Negative Electrode Active Material for Lithium Ion Secondary Battery, Negative Electrode for Lithium Ion Secondary Battery, and Lithium Ion Secondary Battery
Negative Electrode Active Material for Lithium Ion Secondary Battery, Negative Electrode for Lithium Ion Secondary Battery, and Lithium Ion Secondary Battery
Thermal Conduction Sheet and Heat Dissipating Device Including Thermal Conduction Sheet
Temporary Protective Film for Semiconductor Encapsulationmolding, Lead Frame Provided with Temporary Protective Film, Encapsulated Molded Body Provided with Temporary Protectivefilm, and Method for Manufacturing Semiconductor Device
Polishing Liquid, Polishing Liquid Set and Polishing Method
Photosensitive Element, Resin Composition for Forming Barrier Layer, Method for Forming Resist Pattern, and Method for Manufacturing Printed Wiring Board
Resin Film for Interlayer Insulating Layer with Support, Multilayer Printed Circuit Board, and Method of Manufacturing Multilayer Printed Circuit Board
Fluororesin Substrate Laminate
Copper Paste for Pressureless Bonding, Bonded Body and Semiconductor Device
Polishing Method Using Cmp Polishing Liquid
Polishing Liquid and Polishing Method
Copper-Clad Laminate, Printed Wiring Board, Semiconductor Package and Method for Producing Copper-Clad Laminate
Slurry, Method for Producing Polishing Liquid, and Polishing Method
Slurry, Polishing Solution Production Method, and Polishing Method
Slurry and Polishing Method
Slurry and Polishing Method
Slurry, and Polishing Method
Slurry, Screening Method, and Polishing Method
Iron-Based Sintered Sliding Material and Method for Producing the Same
Application:
17/272,218 →
Publication:
US US20210316364A1
Slurry and Polishing Method
Brazing Filler Material for Bonding Iron-Based Sintered Member, and Method for Producing Iron-Based Sintered Part
Sealing Resin Composition, Electronic Component Device, and Method of Manufacturing Electronic Component Device
Laminate, Printed Wiring Board, Semiconductor Package, and Method for Manufacturing Laminate
Wiring Board and Method for Manufacturing the Same
Wiring Board and Production Method for Same
Reactive Hot-Melt Adhesive Composition, and Bonded Body and Method for Producing Same
Polishing Liquid and Polishing Method
Method for Producing Electronic Component Device and Laminated Film Used Therefor
Method for Manufacturing Electronic Component Device
Polishing Solution, Polishing Solution Set, Polishing Method, and Defect Suppressing Method
Polishing Solution and Polishing Method
Polishing Solution, Dispersion, Polishing Solution Production Method, and Polishing Method
Resin Formed Article and Method for Producing Resin Formed Article
Cooling Structure
Photosensitive Resin Composition, Photosensitive Resin Film, Multilayer Printed Wiring Board, Semiconductor Package, and Method for Producing Multilayer Printed Wiring Board
Application:
17/440,238 →
Publication:
US US20220179308A1
Photosensitive Resin Composition, Photosensitive Resin Film, Multilayer Printed Wiring Board, Semiconductor Package, and Method for Producing Multilayer Printed Wiring Board
Application:
17/440,269 →
Publication:
US US20220155681A1
Photosensitive Resin Composition, Photosensitive Resin Film, Printed Wiring Board, Semiconductor Package, and Method for Producing Printed Wiring Board
Cooling Structure
Application:
17/440,554 →
Publication:
US US20220149692A1
Resin Composition, Film and Cured Product
Application:
17/442,010 →
Publication:
US US20220177670A1
Temporary Protective Film for Semiconductor Encapsulation Molding, Lead Frame Provided with Temporary Protective Film, Encapsulated Molded Body Provided with Temporary Protective Film, and Method for Manufacturing Semiconductor Device
Polishing Liquid, Polishing Liquid Set, and Polishing Method
Resin Composition, Prepreg, Laminate, Multilayer Printed Wiring Board, and Semiconductor Package
Optically Softening Resin Composition, Method for Producing Softened Product of Optically Softening Resin Composition, Curable Resin Composition and Cured Product of Same, and Patterned Film and Method for Producing Same
Method for Producing Substrate Having Through-Silicon Vias, Substrate Having Through-Silicon Vias, and Copper Paste for Through-Silicon via Formation
Moisture-Curable Hot-Melt Adhesive Composition, Bonded Object, and Garment
Polyamideimide Resin Composition and Method for Producing Polyamideimide Resin
Ornament and Silver Mirror Film-Forming Liquid
Electrically-Insulating Resin Composition and Electrical Insulator
Method for Manufacturing Electronic Component Device, and Electronic Component Device
Method for Manufacturing Electronic Component Device and Electronic Component Device
Hot Melt Adhesive Composition
Maleimide Resin Composition, Prepreg, Laminated Board, Resin Film, Multilayer Printed Wiring Board, and Semiconductor Package
Photosensitive Resin Composition, Photosensitive Resin Film, Multilayer Printed Wiring Board, Semiconductor Package, and Production Method for Multilayer Printed Wiring Board
Application:
17/634,927 →
Publication:
US US20220276558A1
Lead-Free Low-Melting Glass Composition and Low-Melting Glass Composite Material and Low-Melting Glass Paste Containing Lead-Free Low-Melting Glass Composition, and Sealing Structure, Electrical and Electronic Part and Coated Part Using Same
Negative Electrode Material for Lithium Ion Secondary Battery, Method of Manufacturing Negative Electrode Material for Lithium Ion Secondary Battery, Negative Electrode Material Slurry for Lithium Ion Secondary Battery, Negative Electrode for Lithium Ion Secondary Battery, and Lithium Ion Secondary Battery
Polyamideimide Resin, Resin Composition, and Semiconductor Device
Water-Repellent Agent, Water-Repellent Structure, and Production Method for Said Structure
Application:
17/712,205 →
Publication:
US US20220228029A1
Copper Paste for Joining, Method for Manufacturing Joined Body, and Joined Body
Photosensitive Resin Film, Resist Pattern Forming Method, and Wiring Pattern Forming Method
Application:
17/767,655 →
Publication:
US US20240111211A1
Method for Manufacturing Electronic Component Device and Electronic Component Device
Application:
17/768,746 →
Publication:
US US20240112941A1
Polishing Liquid, Polishing Liquid Set, and Polishing Method
Polishing Agent, Stock Solution for Polishing Agent, and Polishing Method
Application:
17/792,227 →
Publication:
US US20230094224A1
Photosensitive Resin Composition, Photosensitive Resin Film, Multilayered Printed Wiring Board, Semiconductor Package, and Method for Producing Multilayered Printed Wiring Board
Cmp Polishing Liquid and Polishing Method
Application:
17/797,333 →
Publication:
US US20230054199A1
Negative Electrode for Secondary Cell, Secondary Cell, and Negative Electrode Material for Secondary Cell
Application:
17/798,470 →
Publication:
US US20230071493A1
Photosensitive Resin Composition, Method for Selecting Photosensitive Resin Composition, Method for Producing Patterned Cured Film, and Method for Producing Semiconductor Device
Connected Electronic Members
Polyimide Precursor, Resin Composition, Insulated Electric Wire, and Flexible Substrate
Photosensitive Resin Composition, Photosensitive Element, and Method for Producing Wiring Board
Application:
17/913,016 →
Publication:
US US20230145264A1
Production Method for Semiconductor Packages
Polishing Liquid and Polishing Method
Polishing Liquid and Polishing Method
Application:
17/918,203 →
Publication:
US US20230128096A1
Photosensitive Film, Photosensitive Element, and Method for Producing Laminate
Application:
17/922,867 →
Publication:
US US20230161248A1
Cmp Polishing Liquid and Polishing Method
Application:
17/925,175 →
Publication:
US US20230174822A1
Dust Core Compound, Molded Body, and Dust Core
Adhesive Film for Circuit Connection, and Circuit Connection Structure and Manufacturing Method Therefor
Adhesive Set, Film, Bonded Body, and Method for Separating Adherend
Application:
17/926,385 →
Publication:
US US20230235205A1
Photocurable Composition, Cured Product of Same, Photofusible Resin Composition and Adhesive Set
Wiring Structure, Method for Manufacturing Same, and Semiconductor Package
Polishing Liquid and Polishing Method
Thermal Conduction Sheet and Heat Dissipating Device Including Thermal Conduction Sheet
Negative Electrode Material for Lithium Ion Secondary Battery, Negative Electrode for Lithium Ion Secondary Battery, and Lithium Ion Secondary Battery
Temporary protective film for manufacturing semiconductor devices
Patent:
999,179 →
Application:
29/834,581 →
Temporary protective film for manufacturing semiconductor devices
Patent:
998,577 →
Application:
29/834,586 →
Photosensitive Resin Composition, Dry Film, Printed Wiring Board, and Method for Producing Printed Wiring Board
Photosensitive Resin Composition, Photosensitive Resin Film, Multilayered Printed Wiring Board, Semiconductor Package, and Method for Producing Multilayered Printed Wiring Board
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 28, 2013
From: KOTAKE, TOMOHIKO; MIYATAKE, MASATO; NAGAI, SHUNSUKE; HASHIMOTO, SHINTARO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 031102/0375 →
Assignment of Assignor's Interest
May 22, 2014
From: OGIHARA, HIROKUNI; FURUSAWA, FUMIO; NAKAMURA, SHINYA; IKEUCHI, TAKATOSHI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 032952/0312 →
Assignment of Assignor's Interest
Nov 12, 2015
From: KOUZU, MASAYUKI; TSUCHIYA, HIDEYUKI; OHZEKI, KATSUTOMO; OOSAKI, YOSHIE
To: HITACHI CHEMICAL COMPANY, LTD
Reel/Frame 037021/0561 →
Assignment of Assignor's Interest
Jun 21, 2017
From: KUSHIDA, KEISUKE; SHIMIZU, HIROSHI; KAKITANI, MINORU; SHIRAOKAWA, YOSHIKATSU
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 042773/0705 →
Assignment of Assignor's Interest
Jun 21, 2017
From: SHIRAOKAWA, YOSHIKATSU; KAKITANI, MINORU; SHIMIZU, HIROSHI; KUSHIDA, KEISUKE
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 042773/0426 →
Assignment of Assignor's Interest
Jun 26, 2017
From: NAGOSHI, TOSHIMASA; TANAKA, SHIGEO; FUKUZUMI, SHIZU
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 042818/0877 →
Assignment of Assignor's Interest
Oct 27, 2017
From: NAGAI, YUKI; MIZUNO, YASUYUKI; FUKUDA, TOMIO; TANIGAWA, TAKAO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 043974/0540 →
Assignment of Assignor's Interest
Nov 1, 2017
From: TOSAKA, YUJI; SATOH, YOSHINORI; SAITOH, TAKESHI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 044008/0757 →
Assignment of Assignor's Interest
Jan 3, 2018
From: KATAGI, HIDEYUKI; TANAKA, KENJI; TAKEZAWA, YOSHITAKA; SUE, HARUAKI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 044522/0684 →
Assignment of Assignor's Interest
Jan 3, 2018
From: TANIGAWA, TAKAO; IRINO, TETSUROH; KONDOU, YUUSUKE; SHIMAYAMA, YUICHI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 044523/0838 →
Assignment of Assignor's Interest
Mar 1, 2018
From: KOTAKE, TOMOHIKO; TAKAYASU, SATOSHI; AKASU, YUTA; IZUMI, HIROYUKI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 045082/0094 →
Assignment of Assignor's Interest
Mar 13, 2018
From: KATOU, SADAAKI; KOMINE, TAKUYA; FUJII, SHINJIRO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 045190/0570 →
Assignment of Assignor's Interest
Mar 23, 2018
From: ONOZEKI, HITOSHI; INOUE, TSUBASA; YAMAGISHI, KATSUJI; SHIMIZU, HIROSHI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 045324/0385 →
Assignment of Assignor's Interest
Apr 27, 2018
From: ISHIKAWA, DAI; KAWANA, YUKI; SUGAMA, CHIE; NAKAKO, HIDEO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 045658/0476 →
Assignment of Assignor's Interest
Jul 16, 2018
From: AKUTSU, TOSHIAKI; MINAMI, HISATAKA; MINAMI, TOMOHIRO; YAMASHITA, TETUSRO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 046359/0280 →
Corrective Assignment to Correct the Third and Fourth Inventor Names Previously Recorded at Reel: 046359 Frame: 0280. Assignor(S) Hereby Confirms the Assignment .
Jul 20, 2018
From: AKUTSU, TOSHIAKI; MINAMI, HISATAKA; IWANO, TOMOHIRO; YAMASHITA, TETSURO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 046597/0328 →
Assignment of Assignor's Interest
Jan 8, 2020
From: SHIRAKAWA, TETSUYUKI; IZAWA, HIROYUKI; FUKUI, TAKAHIRO; KUMADA, TATSUYA
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 051448/0367 →
Assignment of Assignor's Interest
Jan 8, 2020
From: SHIRAKAWA, TETSUYUKI; IZAWA, HIROYUKI; KUMADA, TATSUYA
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 051452/0519 →
Change of Name
Oct 30, 2020
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 054259/0553 →
Change of Name
Nov 9, 2020
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 054360/0789 →
Change of Name
Nov 16, 2020
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 054431/0445 →
Change of Name
Dec 9, 2020
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 054655/0652 →
Change of Name
Dec 22, 2020
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 054837/0001 →
Change of Name
Jan 26, 2021
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 055109/0600 →
Change of Name
Jan 28, 2021
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 055146/0872 →