Sealing resin composition, electronic component device, and method of manufacturing electronic component device
A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 μm to 20 μm and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 m 2 /g or more.
1. A sealing resin composition comprising:
an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein:
the inorganic filler (C) comprises a first inorganic filler (C1) having an average particle size from 0.1 μm to 20 μm and a second inorganic filler (C2) having an average particle size from 10 nm to 60 nm, and
a value obtained by multiplying a specific surface area of the inorganic filler (C) by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition is from 5.4 m 2 /g to 30 m 2 /g.
2. The sealing resin composition according to claim 1 , having a viscosity, at 110° C., of 0.20 Pa·s or less.
3. The sealing resin composition according to claim 1 , wherein a proportion of the second inorganic filler (C2) having an average particle size from 10 nm to 60 nm in the inorganic filler (C) is 0.3% by mass or more.
4. The sealing resin composition according to claim 1 , wherein a proportion of the second inorganic filler (C2) having an average particle size from 10 nm to 60 nm in the inorganic filler (C) is 30% by mass or less.
5. The sealing resin composition according to claim 1 , wherein a proportion of the first inorganic filler (C1) having an average particle size from 0.1 μm to 20 μm in the inorganic filler (C) is 70% by mass or more.
6. The sealing resin composition according to claim 1 , having a viscosity, at 25° C., from 0.1 Pa·s to 50.0 Pa·s.
7. The sealing resin composition according to claim 1 , wherein the first inorganic filler (C1) having an average particle size from 0.1 μm to 20 μm comprises silica.
8. The sealing resin composition according to claim 1 , wherein the second inorganic filler (C2) having an average particle size from 10 nm to 60 nm comprises silica.
9. The sealing resin composition according to claim 1 , wherein a content of the inorganic filler (C) is from 40% by mass to 85% by mass.
10. The sealing resin composition according to claim 1 , wherein a specific surface area of the first inorganic filler (C1) having an average particle size from 0.1 μm to 20 μm is from 1 m 2 /g to 30 m 2 /g.
11. The sealing resin composition according to claim 1 , wherein a specific surface area of the second inorganic filler (C2) having an average particle size from 10 nm to 60 nm is from 20 m 2 /g to 500 m 2 /g.
12. The sealing resin composition according to claim 1 , having a thixotropic index, at 25° C., from 0.5 to 1.5.
13. The sealing resin composition according to claim 1 , wherein the value obtained by multiplying the specific surface area of the inorganic filler (C), by the proportion of the mass of the inorganic filler (C) in the solid mass of the sealing resin composition is from 5.4 m 2 /g to 14.0 m 2 /g.
14. An electronic component device comprising:
a substrate having a circuit layer,
an electronic component disposed on the substrate and electrically connected to the circuit layer, and
a cured product of the sealing resin composition according to claim 1 , disposed in a gap between the substrate and the electronic component.
15. A method of manufacturing an electronic component device, comprising:
a step of sealing, with the sealing resin composition according to claim 1 , a substrate having a circuit layer and an electronic component disposed on the substrate and electrically connected to the circuit layer.