Sealing resin composition, electronic component device, and method of manufacturing electronic component device
A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 μm to 20 μm and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 mm 2 /g or more.
1. A sealing resin composition comprising:
an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein:
the inorganic filler (C) comprises a first inorganic filler (C1) having an average particle size from 0.1 μm to 20 μm and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm,
a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 m 2 /g or more, and
the sealing resin composition has a viscosity, at 25° C., from 0.1 Pa·s to 50.0 Pa·s.
2. The sealing resin composition according to claim 1 , having a viscosity, at 110° C., of 0.20 Pa·s or less.
3. The sealing resin composition according to claim 1 , wherein a proportion of the second inorganic filler (C2) having an average particle size from 10 nm to 80 nm in the inorganic filler (C) is 0.3% by mass or more.
4. The sealing resin composition according to claim 1 , wherein a proportion of the second inorganic filler (C2) having an average particle size from 10 nm to 80 nm in the inorganic filler (C) is 30% by mass or less.
5. The sealing resin composition according to claim 1 , wherein a proportion of the first inorganic filler (C1) having an average particle size from 0.1 μm to 20 μm in the inorganic filler (C) is 70% by mass or more.
6. The sealing resin composition according to claim 1 , wherein the first inorganic filler (C1) having an average particle size from 0.1 μm to 20 μm comprises silica.
7. The sealing resin composition according to claim 1 , wherein the second inorganic filler (C2) having an average particle size from 10 nm to 80 nm comprises silica.
8. The sealing resin composition according to claim 1 , wherein a content of the inorganic filler (C) is from 40% by mass to 85% by mass.
9. The sealing resin composition according to claim 1 , wherein a specific surface area of the first inorganic filler (C1) having an average particle size from 0.1 μm to 20 μm is from 1 m 2 /g to 30 m 2 /g.
10. The sealing resin composition according to claim 1 , wherein a specific surface area of the second inorganic filler (C2) having an average particle size from 10 nm to 80 nm is from 20 m 2 /g to 500 m 2 /g.
11. The sealing resin composition according to claim 1 , having a thixotropic index, at 25° C., from 0.5 to 1.5.
12. The sealing resin composition according to claim 1 , wherein the sealing resin composition has a viscosity, at 25° C., from 0.1 Pa·s to 20.0 Pa·s.
13. The sealing resin composition according to claim 1 , wherein the sealing resin composition has a viscosity, at 25° C., from 0.1 Pa·s to 10.0 Pa·s.
14. The sealing resin composition according to claim 1 , wherein the epoxy resin (A) comprises an epoxy resin that is liquid at 25° C.
15. An electronic component device comprising:
a substrate having a circuit layer,
an electronic component disposed on the substrate and electrically connected to the circuit layer, and
a cured product of the sealing resin composition according to claim 1 , disposed in a gap between the substrate and the electronic component.
16. A method of manufacturing an electronic component device, comprising:
a step of sealing, with the sealing resin composition according to claim 1 , a substrate having a circuit layer and an electronic component disposed on the substrate and electrically connected to the circuit layer.