Patent Assignment
Reel/Frame 057038/0603
Change of Name
Recorded: 2021-07-30
Pages: 32
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Sealing Resin Composition, Electronic Component Device, and Method of Manufacturing Electronic Component Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 30, 2019
From: TAKEUCHI, YUMA; TAKAHASHI, HISATO; INABA, YOSHIHITO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 049032/0308 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →