IP Library Granted Patent US 11,319,466
Granted Patent B2
US 11,319,466 · App. 16/486,547 · Granted May 3, 2022

Adhesive film

Inventors: Tetsuyuki Shirakawa (Tokyo, JP); Hiroyuki Izawa (Tokyo, JP); Tatsuya Kumada (Tokyo, JP)
Assignee: SHOWA DENKO MATERIALS CO., LTD.
C09J9/02C08K3/08C09J11/04C09J201/00C08K2003/0831C08K2003/0862C08K2201/001C09J2203/326C09J2400/16
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Quick Facts
Patent No.
US 11,319,466
App. No.
16/486,547
Granted
May 3, 2022
Kind
B2
Abstract

One aspect of the present invention is an adhesive film comprising: a first adhesive layer comprising a first adhesive component, a first conductive particle that is a dendritic conductive particle, and a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body; and a second adhesive layer comprising a second adhesive component, wherein a volume proportion of the second adhesive component in the second adhesive layer is larger than a volume proportion of the first adhesive component in the first adhesive layer.

Claims (21)

1. An adhesive film comprising:

a first adhesive layer comprising a first adhesive component, a first conductive particle that is a dendritic conductive particle, and a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body, wherein a content of the first conductive particle in the first adhesive layer is 2% by volume or more and 25% by volume or less based on the total volume of the first adhesive layer, and wherein a content of the second conductive particle in the first adhesive layer is 2% by volume or more and 20% by volume or less based on the total volume of the first adhesive layer; and

a second adhesive layer comprising a second adhesive component,

wherein a volume proportion of the second adhesive component in the second adhesive layer is larger than a volume proportion of the first adhesive component in the first adhesive layer.

2. The adhesive film according to claim 1 , wherein the second adhesive layer consists of the second adhesive component.

3. The adhesive film according to claim 1 , the conductive layer comprises at least one selected from the group consisting of gold, nickel, and palladium.

4. An adhesive film comprising:

a first adhesive layer comprising a first adhesive component, a first conductive particle that is a dendritic conductive particle, and a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body, wherein the first adhesive component contains a material exhibiting curability by heat or light and a thermoplastic resin, and wherein the thermoplastic resin includes a phenoxy resin, a polyvinyl formal resin, a polystyrene resin, a polyvinyl butyral resin, a polyester resin, a polyamide resin, a xylene resin, a polyurethane resin, a polyester urethane resin, a phenol resin, or a terpene phenol resin, and wherein a content of the first conductive particle in the first adhesive layer is 2% by volume or more and 25% by volume or less based on the total volume of the first adhesive layer; and

a second adhesive layer comprising a second adhesive component,

wherein a volume proportion of the second adhesive component in the second adhesive layer is larger than a volume proportion of the first adhesive component in the first adhesive layer.

5. The adhesive film according to claim 4 , wherein a content of the second conductive particle in the first adhesive layer is 2% by volume or more and 20% by volume or less based on the total volume of the first adhesive layer.

6. The adhesive film according to claim 4 , wherein the second adhesive layer consists of the second adhesive component.

7. The adhesive film according to claim 4 , wherein the conductive layer comprises at least one selected from the group consisting of gold, nickel, and palladium.

8. An adhesive film comprising:

a first adhesive layer comprising a first adhesive component, a first conductive particle that is a dendritic conductive particle, and a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body, wherein a content of the first conductive particle in the first adhesive layer is 2% by volume or more and 25% by volume or less based on the total volume of the first adhesive layer; and

a second adhesive layer comprising a second adhesive component,

wherein a volume proportion of the second adhesive component in the second adhesive layer is larger than a volume proportion of the first adhesive component in the first adhesive layer,

wherein a volume proportion of the first adhesive component in the first adhesive layer is 85% by volume or less based on the total volume of the first adhesive layer, and wherein the volume proportion of the second adhesive component in the second adhesive layer is 90% by volume or more based on the total volume of the second adhesive layer.

9. The adhesive film according to claim 8 , wherein the second adhesive layer consists of the second adhesive component.

10. The adhesive film according to claim 8 , wherein the conductive layer comprises at least one selected from the group consisting of gold, nickel, and palladium.

11. The adhesive film according to claim 8 , wherein a content of the second conductive particle in the first adhesive layer is 2% by volume or more and 20% by volume or less based on the total volume of the first adhesive layer.

Assignments (4)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
CHANGE OF NAME Recorded Sep 14, 2021
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 057498/0313 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 8, 2020
From: SHIRAKAWA, TETSUYUKI; IZAWA, HIROYUKI; KUMADA, TATSUYA
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 051452/0519 →