IP Library Granted Patent US 11,339,284
Granted Patent B2
US 11,339,284 · App. 16/759,601 · Granted May 24, 2022

Resin composition, cured product, formed body and manufacturing method thereof, and film capacitor and manufacturing method thereof

Inventors: Kasumi Nakamura (Tokyo, JP); Tatsuhito Fukuhara (Tokyo, JP); Yasunori Kawabata (Tokyo, JP); Takahide Iwaya (Tokyo, JP)
Assignee: SHOWA DENKO MATERIALS CO., LTD.
C08L63/00C08K3/04C08K3/22C08K3/36C08K5/34922C08K7/24H01G4/224C08K2003/2227C08K2201/005C08L2203/206
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,339,284
App. No.
16/759,601
Granted
May 24, 2022
Kind
B2
Abstract

A resin composition for casting, containing a curable component, a first filler, and a second filler that is different from the first filler, in which a ratio of a major axis of the first filler with respect to a thickness of the first filler is 3 to 25. A molded body including an element and a sealing portion that seals the element, in which the sealing portion contains the resin composition or a cured product thereof.

Claims (26)

1. A resin composition for casting, comprising a curable component, a first filler containing expandable graphite, and a second filler that is different from the first filler,

wherein a ratio of a major axis of the first filler with respect to a thickness of the first filler is 3 or more and less than 20.

2. The resin composition according to claim 1 , wherein the curable component includes an epoxy resin.

3. The resin composition according to claim 1 , wherein a viscosity of the resin composition when measured using a B type viscometer under conditions of 40° C. and 60 rpm is 8.0 Pa·s or less.

4. The resin composition according to claim 1 , wherein the first filler further contains melamine cyanurate.

5. The resin composition according to claim 1 , wherein the second filler contains silica.

6. A cured product of the resin composition according to claim 1 .

7. A molded body comprising: an element and a sealing portion that seals the element,

wherein the sealing portion contains the resin composition according to claim 1 or a cured product thereof.

8. A method for producing a molded body, the method comprising casting the resin composition according to claim 1 to obtain a molded body.

9. A film capacitor comprising: a film capacitor element and a sealing portion that seals the film capacitor element,

wherein the sealing portion contains the resin composition according to claim 1 or a cured product thereof.

10. A method for producing a film capacitor, the method comprising casting the resin composition according to claim 1 to obtain a film capacitor comprising a sealing portion that seals a film capacitor element.

11. The resin composition according to claim 1 , wherein the curable component includes a curable resin, and

a content of the curable resin is 18% by mass or more based on a total mass of the resin composition.

12. The resin composition according to claim 1 , wherein the first filler further contains at least one selected from the group consisting of scale-like graphite, melamine cyanurate, and wollastonite.

13. The resin composition according to claim 1 , wherein the major axis of the first filler is 5 to 800 μm.

14. The resin composition according to claim 1 , wherein a content of the first filler is 9% by mass or less based on a sum amount of the first filler and the second filler.

15. The resin composition according to claim 1 , wherein a content of the first filler is 1.5% to 30% by mass based on a total mass of the resin composition.

16. The resin composition according to claim 1 , wherein the second filler contains carbon black.

17. The resin composition according to claim 1 , wherein the second filler contains aluminum hydroxide.

18. The resin composition according to claim 1 , wherein a particle size of the second filler is 3 to 30 μm.

19. The resin composition according to claim 1 , wherein a content of the second filler is 30% to 90% by mass based on a total mass of the resin composition.

20. A resin composition for casting, comprising a curable component, a first filler containing melamine cyanurate, and a second filler containing silica,

wherein a ratio of a major axis of the first filler with respect to a thickness of the first filler is 3 to 25, and

a content of the silica is 30 to 55.8 mass % based on a total mass of the resin composition.

Assignments (4)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
CHANGE OF NAME Recorded Feb 3, 2022
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 058952/0385 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 12, 2020
From: NAKAMURA, KASUMI; FUKUHARA, TATSUHITO; KAWABATA, YASUNORI; IWAYA, TAKAHIDE
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 054024/0413 →