IP Library Assignment 058952/0385
Patent Assignment
Reel/Frame 058952/0385

Change of Name

Recorded: 2022-02-03 Pages: 52
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Resin Composition, Cured Product, Formed Body and Manufacturing Method Thereof, and Film Capacitor and Manufacturing Method Thereof
Application: 16/759,601 →
Publication: US 2020/0347221
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 12, 2020
From: NAKAMURA, KASUMI; FUKUHARA, TATSUHITO; KAWABATA, YASUNORI; IWAYA, TAKAHIDE
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 054024/0413 →
Change of Name Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →