Patent Assignment
Reel/Frame 045658/0476
Assignment of Assignor's Interest
Recorded: 2018-04-27
Pages: 4
Assignors
ISHIKAWA, DAI
Executed: 2018-04-12
KAWANA, YUKI
Executed: 2018-03-27
SUGAMA, CHIE
Executed: 2018-03-27
NAKAKO, HIDEO
Executed: 2018-03-20
EJIRI, YOSHINORI
Executed: 2018-03-21
KURAFUCHI, KAZUHIKO
Executed: 2018-03-20
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Copper Paste for Joining, Method for Manufacturing Joined Body, and Method for Manufacturing Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
May 17, 2021
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 056323/0478 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →