Patent Assignment
Reel/Frame 056323/0478
Change of Name
Recorded: 2021-05-17
Pages: 52
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Copper Paste for Joining, Method for Manufacturing Joined Body, and Method for Manufacturing Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 27, 2018
From: ISHIKAWA, DAI; KAWANA, YUKI; SUGAMA, CHIE; NAKAKO, HIDEO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 045658/0476 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →