Patent Assignment
Reel/Frame 045190/0570
Assignment of Assignor's Interest
Recorded: 2018-03-13
Pages: 2
Assignors
KATOU, SADAAKI
Executed: 2018-02-13
KOMINE, TAKUYA
Executed: 2018-02-14
FUJII, SHINJIRO
Executed: 2018-02-16
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Adhesive Composition, Cured Article, Semiconductor Device, and Production Method for Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Nov 16, 2020
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 054431/0445 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →