Adhesive composition, cured article, semiconductor device, and production method for same

1. An adhesive composition comprising:

(a) a (meth)acrylic polymer;

(b) a compound having at least two (meth)acryloyl groups, a content of the compound

(b) relative to a total of 100 parts by mass of the component (a) and the component (b) being 20 parts by mass or more;

(c) a polymerization initiator; and

(d) a filler.

2. The adhesive composition according to claim 1 , wherein a content of the component (d) relative to the total of 100 parts by mass of the component (a) and the component (b) is 0.1 to 40 parts by mass.

3. The adhesive composition according to claim 1 , wherein an average particle size of the component (d) is 5 to 10000 nm.

4. The adhesive composition according to claim 1 , wherein the component (a) has an alicyclic structure.

5. The adhesive composition according to claim 1 , wherein the component (a) has an epoxy group.

6. The adhesive composition according to claim 1 , wherein the component (a) has a structural unit represented by the following general formula (1):

wherein, in formula (I), R 1a represents a hydrogen atom or a methyl group, and X a represents a group containing an epoxy group.

7. The adhesive composition according to claim 1 , further comprising an antioxidant.

8. A cured article of the adhesive composition according to claim 1 .

9. A method for producing a semiconductor device, comprising:

a step of forming an adhesive layer containing the adhesive composition according to claim 1 on a semiconductor substrate; and

a step of curing the adhesive layer in a state that the adhesive layer is disposed between the semiconductor substrate and a transparent base material.

10. A semiconductor device comprising:

a semiconductor substrate;

an adhesive layer disposed on the semiconductor substrate; and

a transparent base material bonded to the semiconductor substrate via the adhesive layer, wherein

the adhesive layer contains the adhesive composition according to claim 1 or a cured article thereof.

11. The semiconductor device according to claim 10 , which is optical part.

12. The adhesive composition according to claim 1 , wherein a weight average molecular weight of the component (a) is 100000 or more.

13. The adhesive composition according to claim 12 , wherein the content of the component (b) relative to the total of 100 parts by mass of the component (a) and the component (b) is 30 parts by mass or more.

14. The adhesive composition according to claim 12 , wherein an average particle size of the component (d) is 500 nm or less.

15. The adhesive composition according to claim 14 , wherein a content of the component (d) relative to the total of 100 parts by mass of the component (a) and the component (b) is 5 parts by mass or more.

16. The adhesive composition according to claim 1 , wherein a weight average molecular weight of the component (a) is 200000 or more.

17. The adhesive composition according to claim 16 , wherein a content of the component (d) relative to the total of 100 parts by mass of the component (a) and the component (b) is 5 parts by mass or more.

18. The adhesive composition according to claim 1 , wherein a weight average molecular weight of the component (a) is 400000 or more.

19. The adhesive composition according to claim 1 , wherein a content of the component (d) relative to Han the total of 100 parts by mass of the component (a) and the component (b) is 0.1 parts by mass or more.