Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring board
There is provided a photosensitive resin composition that contains (A) a photopolymerizable compound having an ethylenically unsaturated group, (X) organic particles, and (B) a photopolymerization initiator, in which the photopolymerizable compound (A) having an ethylenically unsaturated group contains (A1) a photopolymerizable compound having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group. There is provided a photosensitive resin film and a photosensitive resin film for interlayer insulating layer, each of which contains the photosensitive resin composition. There is provided a multilayer printed wiring board and a semiconductor package. There is further provided a method for producing the multilayer printed wiring board.
1 . A photosensitive resin composition comprising:
(A) a photopolymerizable compound having an ethylenically unsaturated group;
(X) organic particles; and
(B) a photopolymerization initiator, wherein
the photopolymerizable compound (A) having an ethylenically unsaturated group contains (A1) a photopolymerizable compound having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group,
the organic particles (X) contain core-shell particles, and
a combination (core/shell) of a component constituting cores of the core-shell particles and a component constituting shells thereof is styrene-butadiene copolymer/(meth)acrylic acid ester copolymer, (meth)acrylic acid ester copolymer/epoxy resin, epoxy resin/silicone rubber, acrylonitrile-butadiene copolymer/(meth)acrylic acid ester copolymer, polyethylene/(meth)acrylic acid ester copolymer, polybutadiene/(meth)acrylic acid ester copolymer, or polyester/(meth)acrylic acid ester copolymer.
2 . The photosensitive resin composition according to claim 1 , wherein
the photopolymerizable compound (A) having an ethylenically unsaturated group further contains at least one selected from the group consisting of (Ai) a monofunctional vinyl monomer having one polymerizable ethylenically unsaturated group, (Aii) a bifunctional vinyl monomer having two polymerizable ethylenically unsaturated groups, and (Aiii) a polyfunctional vinyl monomer having at least three polymerizable ethylenically unsaturated groups.
3 . The photosensitive resin composition according to claim 1 , wherein
in the photopolymerizable compound (A1) having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group, the alicyclic structure is an alicyclic structure having 5 to 20 ring carbon atoms.
4 . The photosensitive resin composition according to claim 1 , wherein
in the photopolymerizable compound (A1) having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group, the alicyclic structure is composed of two or more rings.
5 . The photosensitive resin composition according to claim 1 , further comprising:
(C) a thermosetting resin.
6 . The photosensitive resin composition according to claim 1 , further comprising:
(D) an elastomer.
7 . The photosensitive resin composition according to claim 6 , wherein
the elastomer (D) contains at least one selected from the group consisting of a styrenic elastomer, an olefinic elastomer, a polyester-based elastomer, a urethane-based elastomer, a polyamide-based elastomer, an acrylic elastomer, and a silicone-based elastomer.
8 . The photosensitive resin composition according to claim 1 , further comprising:
(F) an inorganic filler.
9 . A photosensitive resin composition for photo via formation, comprising:
the photosensitive resin composition according to claim 1 .
10 . A photosensitive resin composition for interlayer insulating layer, comprising:
the photosensitive resin composition according to claim 1 .
11 . A photosensitive resin film comprising:
the photosensitive resin composition according to claim 1 .
12 . A photosensitive resin film for interlayer insulating layer, comprising:
the photosensitive resin composition according to claim 1 .
13 . A multilayer printed wiring board comprising:
an interlayer insulating layer formed of the photosensitive resin composition according to claim 1 .
14 . A multilayer printed wiring board comprising:
an interlayer insulating layer formed of the photosensitive resin film according to claim 11 .
15 . A semiconductor package comprising:
the multilayer printed wiring board according to claim 13 , and a semiconductor device.
16 . A method for producing a multilayer printed wiring board, comprising the following (1) to (4):
(1): laminating the photosensitive resin film according to claim 11 on one surface or both surfaces of a circuit substrate;
(2): exposing and developing the photosensitive resin film laminated in the (1), to form an interlayer insulating layer having a via;
(3): subjecting the via and the interlayer insulating layer to a roughening treatment; and
(4): forming a circuit pattern on the interlayer insulating layer.