Patent Assignment
Reel/Frame 062570/0371
Assignment of Assignor's Interest
Recorded: 2023-02-02
Pages: 6
Assignors
OTSUKA, KOHEI
Executed: 2022-11-15
SAWAMOTO, HAYATO
Executed: 2022-11-15
NAKAMURA, AKIHIRO
Executed: 2022-11-16
SAKAMOTO, NORIHIKO
Executed: 2022-11-17
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Photosensitive Resin Composition, Photosensitive Resin Film, Multilayered Printed Wiring Board, Semiconductor Package, and Method for Producing Multilayered Printed Wiring Board
Application:
18/019,024 →
Publication:
US 2023/0303750
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.