IP Library Granted Patent US 10,988,585
Granted Patent B2
US 10,988,585 · App. 16/079,739 · Granted Apr 27, 2021

Resin sheet and cured product of resin sheet

Inventors: Tomoo Nishiyama (Tokyo, JP); Yoshitaka Takezawa (Tokyo, JP); Hideyuki Katagi (Tokyo, JP); Kazuya Kiguchi (Tokyo, JP)
Assignee: Showa Denko Materials Co., Ltd.
C08J5/18C08G59/1438C08G59/24C08G59/42C08K3/22C08K3/38C08J2363/00C08K2003/2227C08K2003/385
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Quick Facts
Patent No.
US 10,988,585
App. No.
16/079,739
Granted
Apr 27, 2021
Kind
B2
Abstract

A resin sheet includes an epoxy resin including an epoxy resin oligomer and an epoxy resin monomer; a curing agent; and an inorganic filler, wherein a content of the inorganic filler is more than 30% by volume but less than 80% by volume.

Claims (16)

1. A resin sheet comprising:

an epoxy resin comprising an epoxy resin oligomer and an epoxy resin monomer, wherein the epoxy resin oligomer has a number average molecular weight of from 600 to 2,300;

a curing agent; and

an inorganic filler,

wherein a content of the inorganic filler is more than 30% by volume but less than 80% by volume.

2. The resin sheet according to claim 1 , wherein the epoxy resin oligomer comprises a reaction product of an epoxy resin monomer having a mesogen skeleton, with a divalent phenolic compound having a structure in which two hydroxyl groups are bound to one benzene ring.

3. The resin sheet according to claim 1 , wherein the epoxy resin oligomer comprises a reaction product of a compound represented by the following Formula (1), with a divalent phenolic compound having a structure in which two hydroxyl groups are bound to one benzene ring:

wherein, in Formula (1), each of R1 to R4 independently represents a hydrogen atom or an alkyl group having from 1 to 3 carbon atoms.

4. The resin sheet according to claim 2 , wherein the divalent phenolic compound comprises hydroquinone.

5. The resin sheet according to claim 1 , wherein the epoxy resin monomer comprises a compound comprising a mesogen skeleton and two epoxy groups in a molecule thereof.

6. The resin sheet according to claim 1 , wherein the epoxy resin monomer comprises at least one selected from the group consisting of a compound represented by the following Formula (1) and a biphenyl-type epoxy resin monomer:

wherein, in Formula (1), each of R1 to R4 independently represents a hydrogen atom or an alkyl group having from 1 to 3 carbon atoms.

7. The resin sheet according to claim 1 , wherein the curing agent comprises a dihydroxybenzene novolac resin.

8. The resin sheet according to claim 1 , wherein the resin sheet has an average thickness of from 0.2 mm to 3 mm.

9. A cured product of a resin sheet, which is a cured product of the resin sheet according to claim 1 .

10. The cured product of the resin sheet according to claim 9 , having a diffraction peak in a diffraction angle 2θ range of from 3.0° to 3.5° according to an X-ray diffraction method using CuKα radiation.

Assignments (4)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
CHANGE OF NAME Recorded Mar 26, 2021
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 055743/0220 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2018
From: NISHIYAMA, TOMOO; TAKEZAWA, YOSHITAKA; KATAGI, HIDEYUKI; KIGUCHI, KAZUYA
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 047234/0918 →