Resin composition, laminate sheet, and multilayer printed wiring board
The present invention relates to a resin composition comprising an (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group, and a thermoplastic resin.
1. A resin composition comprising an (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group and a divalent group having at least two structures in which two carbonyl groups are bonded to a nitrogen atom represented by the following formula (I):
wherein in the formula (I), R 1 represents a tetravalent organic group, and a thermoplastic resin.
2. The resin composition according to claim 1 , wherein the number of carbon atoms of the hydrocarbon group is 8 to 100.
3. The resin composition according to claim 1 , wherein the hydrocarbon group is a group represented by the following formula (II):
wherein in the formula (II), R 2 and R 3 each independently represent an alkylene group having 4 to 50 carbon atoms; R 4 represents an alkyl group having 4 to 50 carbon atoms; and R 5 represents an alkyl group having 2 to 50 carbon atoms.
4. The resin composition according to claim 1 , further comprising a (B) aromatic maleimide compound having a structure having a maleimido group bonded to an aromatic ring.
5. The resin composition according to claim 1 , wherein a weight-average molecular weight of the (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group is 500 to 10000.
6. The resin composition according to claim 1 , wherein the thermoplastic resin comprises at least one selected from the group consisting of a styrene-based elastomer, an olefin-based elastomer, a polyphenylene ether, fluororesin-based particles, and polystyrene microparticles.
7. The resin composition according to claim 1 , wherein the (A) maleimide compound has a saturated divalent hydrocarbon group.
8. The resin composition according to claim 4 , wherein the (B) aromatic maleimide compound is a compound represented by the following formula (VI):
wherein in the formula (VI), A 4 represents a residue represented by the following formula (VII), (VIII), (IX) or (X); and A 5 represents a residue represented by the following formula (XI):
wherein in the formula (VII), R 10 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom,
wherein in the formula (VIII), R 11 and R 12 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; and A 6 represents an alkylene group or an alkylidene group having 1 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyl group, a single bond or a residue represented by the following formula (VIII-1):
wherein in the formula (VIII-1), R 13 and R 14 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; and A 7 represents an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyl group or a single bond,
wherein in the formula (IX), i is an integer of 1 to 10,
wherein in the formula (X), R 15 and R 16 each independently represent a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms; and j is an integer of 1 to 8,
wherein in the formula (XI), R 17 and R 18 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, a hydroxyl group or a halogen atom; and A 8 represents an alkylene group or an alkylidene group having 1 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyl group, a fluorenylene group, a single bond, a residue represented by the following formula (XI-1) or a residue represented by the following formula (XI-2):
wherein in the formula (XI-I), R 19 and R 20 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; and A 9 represents an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, a m-phenylenediisopropylidene group, a p-phenylenediisopropylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyl group or a single bond, and
wherein in the formula (XI-2), R 21 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; and A 10 and A 11 each independently represent an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyl group or a single bond.
9. A resin composition comprising:
an (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group and a divalent group having at least two structures in which two carbonyl groups are bonded to a nitrogen atom, and a thermoplastic resin,
a (B) aromatic maleimide compound having a structure having a maleimido group bonded to an aromatic ring, wherein the (B) aromatic maleimide compound is a compound represented by the following formula (VI):
wherein in the formula (VI), A 4 represents a residue represented by the following formula (VII), (VIII), (IX) or (X); and A 5 represents a residue represented by the following formula (XI):
wherein in the formula (VII), R 10 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom,
wherein in the formula (VIII), R 11 and R 12 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; and A 6 represents an alkylene group or an alkylidene group having 1 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyl group, a single bond or a residue represented by the following formula (VIII-1):
wherein in the formula (VIII-1), R 13 and R 14 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; and A 7 represents an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyl group or a single bond,
wherein in the formula (IX), i is an integer of 1 to 10,
wherein in the formula (X), R 15 and R 16 each independently represent a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms; and j is an integer of 1 to 8,
wherein in the formula (XI), R 17 and R 18 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, a hydroxyl group or a halogen atom; and A 8 represents an alkylene group or an alkylidene group having 1 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyl group, a fluorenylene group, a single bond, a residue represented by the following formula (XI-1) or a residue represented by the following formula (XI-2):
wherein in the formula (XI-I), R 19 and R 20 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; and A 9 represents an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, a m-phenylenediisopropylidene group, a p-phenylenediisopropylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyl group or a single bond, and
wherein in the formula (XI-2), R 21 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; and A 10 and A 11 each independently represent an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyl group or a single bond, and
a thermoplastic resin.
10. A laminate comprising:
a resin layer comprising a cured substance of the resin composition according to claim 1 ; and
a conductor layer.
11. A multilayer printed wiring board comprising:
a resin layer comprising a cured substance of the resin composition according to claim 1 ; and
circuit layers.