Patent Assignment
Reel/Frame 048727/0302
Assignment of Assignor's Interest
Recorded: 2019-03-28
Pages: 3
Assignors
TANIGAWA, TAKAO
Executed: 2019-01-22
IRINO, TETSUROH
Executed: 2019-01-24
KAKITANI, MINORU
Executed: 2019-01-30
MORITA, KOUJI
Executed: 2019-02-22
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Resin Composition, Laminate Sheet, and Multilayer Printed Wiring Board
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jun 16, 2021
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 056598/0492 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →