IP Library Assignment 056598/0492
Patent Assignment
Reel/Frame 056598/0492

Change of Name

Recorded: 2021-06-16 Pages: 52
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Resin Composition, Laminate Sheet, and Multilayer Printed Wiring Board
Application: 16/318,726 →
Publication: US 2019/0241729
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 28, 2019
From: TANIGAWA, TAKAO; IRINO, TETSUROH; KAKITANI, MINORU; MORITA, KOUJI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 048727/0302 →
Change of Name Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →