Resin composition, resin layer-provided support, prepreg, laminate sheet, multilayer printed wiring board, and printed wiring board for millimeter-wave radar
The present invention relates to a resin composition containing (A) a compound having a maleimide group, a divalent group having at least two imide bonds, and a saturated or unsaturated divalent hydrocarbon group and (B) a halogen-free flame retardant.
1. A resin composition comprising:
(A) a compound having a maleimide group, a divalent group having at least two imide bonds, and a saturated or unsaturated divalent hydrocarbon group; and
(B) a halogen-free flame retardant.
2. The resin composition according to claim 1 , wherein (B) the halogen-free flame retardant comprises a phenol-based antioxidant.
3. The resin composition according to claim 1 , wherein (B) the halogen-free flame retardant comprises a phosphite-based antioxidant.
4. The resin composition according to claim 1 , wherein (B) the halogen-free flame retardant comprises a thioether-based antioxidant.
5. The resin composition according to claim 1 , wherein (B) the halogen-free flame retardant comprises a phosphorus-based flame retardant.
6. The resin composition according to claim 1 , wherein the divalent group having at least two imide bonds is a group represented by the following Formula (I):
wherein in Formula (I), R 1 represents a tetravalent organic group.
7. The resin composition according to claim 1 , wherein the hydrocarbon group is a group represented by the following Formula (II):
wherein in Formula (II), R 2 and R 3 each independently represent an alkylene group having from 4 to 50 carbon atoms, R 4 represents an alkyl group having from 4 to 50 carbon atoms, and R 5 represents an alkyl group having from 2 to 50 carbon atoms.
8. The resin composition according to claim 1 , further comprising a maleimide group-comprising compound different from the compound.
9. The resin composition according to claim 1 , wherein a dielectric constant of a cured substance of the resin composition is 3.6 or less at 10 GHz.
10. A resin layer-provided support comprising:
a resin layer comprising the resin composition according to claim 1 ; and
a supporting base material.
11. A prepreg comprising:
the resin composition according to any claim 1 ; and
a fiber base material.
12. A laminate sheet comprising:
a resin layer comprising a cured substance of the resin composition according to claim 1 ; and
a conductor layer.
13. A multilayer printed wiring board comprising:
a resin layer comprising a cured substance of the resin composition according to claim 1 ; and
at least three circuit layers.
14. A printed wiring board for millimeter-wave radar comprising:
a resin layer comprising a cured substance of the resin composition according to claim 1 ; and
a circuit layer.
15. An electronic device handling high frequency signals of 1 GHz or more, comprising the multilayer printed wiring board according to claim 13 .
16. The electronic device according to claim 15 , wherein the electronic device is a millimeter-wave radar device.