Patent Assignment
Reel/Frame 048727/0265
Assignment of Assignor's Interest
Recorded: 2019-03-28
Pages: 3
Assignors
TANIGAWA, TAKAO
Executed: 2019-01-22
IRINO, TETSUROH
Executed: 2019-01-24
KAKITANI, MINORU
Executed: 2019-01-29
MORITA, KOUJI
Executed: 2019-02-22
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Resin Composition, Resin Layer-Provided Support, Prepreg, Laminate Sheet, Multilayer Printed Wiring Board, and Printed Wiring Board for Millimeter-Wave Radar
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Dec 29, 2020
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 054861/0246 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →