Patent Assignment
Reel/Frame 054861/0246
Change of Name
Recorded: 2020-12-29
Pages: 52
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Resin Composition, Resin Layer-Provided Support, Prepreg, Laminate Sheet, Multilayer Printed Wiring Board, and Printed Wiring Board for Millimeter-Wave Radar
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 28, 2019
From: TANIGAWA, TAKAO; IRINO, TETSUROH; KAKITANI, MINORU; MORITA, KOUJI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 048727/0265 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →