Liquid epoxy resin composition for sealing, and electronic component device
A liquid epoxy resin composition for sealing includes an epoxy resin, a curing agent, and a particle having a core-shell structure. In the composition, the particle having a core-shell structure includes a core including a cross-linked polysiloxane and a shell including a polymer in which the content of a structural unit having an epoxy group is 10% by mass or more.
1. A liquid epoxy resin composition for sealing, the composition comprising:
an epoxy resin comprising one or more of a liquid diglycidyl ether epoxy resin and a liquid glycidyl amine epoxy resin, the content of the epoxy resin being 15% by mass or more, with respect to the total mass of the liquid epoxy resin composition for sealing;
a curing agent comprising a liquid aromatic amine component, the ratio of the number of active hydrogens in the curing agent to the number of epoxy groups in the epoxy resin being in a range of from 0.5 to 2; and
a particle having a core-shell structure,
wherein the particle having a core-shell structure comprises: a core comprising a cross-linked polysiloxane; and a shell comprising a polymer comprising a copolymer of methyl methacrylate and glycidyl methacrylate, a content of glycidyl methacrylate ranging from 20 to 35% by mass of the copolymer; and
the content of the particle having a core-shell structure ranges from 0.1% by mass to 10% by mass, with respect to the total mass of the liquid epoxy resin composition for sealing.
2. The liquid epoxy resin composition for sealing according to claim 1 , wherein a content of the cross-linked polysiloxane is from 50% by mass to 70% by mass with respect to a total mass of the core and the shell of the particle having a core-shell structure.
3. The liquid epoxy resin composition for sealing according to claim 2 , further comprising a silane coupling agent.
4. An electronic component device, comprising an element sealed with the liquid epoxy resin composition for sealing according to claim 1 .
5. The liquid epoxy resin composition for sealing according to claim 1 , wherein the content of the epoxy resin is 20% by mass or more, with respect to the total mass of the liquid epoxy resin composition for sealing.
6. The liquid epoxy resin composition for sealing according to claim 1 , wherein the content of the epoxy resin is 25% by mass or more, with respect to the total mass of the liquid epoxy resin composition for sealing.
7. The liquid epoxy resin composition for sealing according to claim 1 , wherein the ratio of the number of active hydrogens in the curing agent to the number of epoxy groups in the epoxy resin is in a range of from 0.6 to 1.3.
8. The liquid epoxy resin composition for sealing according to claim 1 , wherein the ratio of the number of active hydrogens in the curing agent to the number of epoxy groups in the epoxy resin is in a range of from 0.8 to 1.2.
9. The liquid epoxy resin composition for sealing according to claim 1 , wherein the content of the particle having a core-shell structure ranges from 0.1% by mass to 7.5% by mass, with respect to the total mass of the liquid epoxy resin composition for sealing.
10. The liquid epoxy resin composition for sealing according to claim 1 , wherein the liquid aromatic amine component comprises one or more of diethyltoluenediamine, 1-methyl-3,5-diethyl-2,4-diaminobenzene, 1-methyl-3,5-diethyl-2,6-diaminobenzene, 1,3,5-triethyl-2,6-diaminobenzene, 3,3′-diethyl-4,4′-diaminodiphenylmethane, and 3,5,3′,5′-tetramethyl-4,4′-diaminodiphenylmethane.
11. The liquid epoxy resin composition for sealing according to claim 10 , wherein a content of the cross-linked polysiloxane is from 50% by mass to 70% by mass with respect to a total mass of the core and the shell of the particle having a core-shell structure.
12. The liquid epoxy resin composition for sealing according to claim 11 , further comprising a silane coupling agent.
13. The liquid epoxy resin composition for sealing according to claim 10 , wherein the content of the epoxy resin is 20% by mass or more, with respect to the total mass of the liquid epoxy resin composition for sealing.
14. The liquid epoxy resin composition for sealing according to claim 10 , wherein the content of the epoxy resin is 25% by mass or more, with respect to the total mass of the liquid epoxy resin composition for sealing.
15. The liquid epoxy resin composition for sealing according to claim 10 , wherein the content of the particle having a core-shell structure ranges from 0.1% by mass to 7.5% by mass, with respect to the total mass of the liquid epoxy resin composition for sealing.