Patent Assignment
Reel/Frame 047968/0599
Assignment of Assignor's Interest
Recorded: 2019-01-11
Pages: 4
Assignors
NOJIRI, NAOYUKI
Executed: 2018-11-05
TAKAHASHI, HISATO
Executed: 2018-10-29
KUNIMI, MAKOTO
Executed: 2018-10-23
HORI, KOHJI
Executed: 2018-10-22
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Liquid Epoxy Resin Composition for Sealing, and Electronic Component Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 11, 2021
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 055561/0442 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →