Polishing solution and polishing method
A polishing liquid containing: abrasive grains containing a metal oxide; at least one hydroxy acid compound selected from the group consisting of a hydroxy acid having a structure represented by General Formula (A1) below and a salt thereof; and water: [In the formula, R 11 represents a hydrogen atom or a hydroxy group, R 12 represents a hydrogen atom, an alkyl group, or an aryl group, n11 represents an integer of 0 or more, and n12 represents an integer of 0 or more; however, a case where both of R 11 and R 12 are a hydrogen atom is excluded.]
1. A polishing liquid comprising: abrasive grains containing a metal oxide; at least one hydroxy acid compound selected from the group consisting of a hydroxy acid having a structure represented by General Formula (A1) below and a salt thereof; and water:
wherein in the formula, R 11 represents a hydrogen atom or a hydroxy group, R 12 represents a hydrogen atom, an alkyl group, or an aryl group, n11 represents an integer of 0 or more, and n12 represents an integer of 0 or more; however, a case where both of R 11 and R 12 are a hydrogen atom is excluded and a case where R 11 is a hydrogen atom, R 12 is a methyl group, n11 is 0, and n12 is 0 is excluded, and
a ratio of a content of the hydroxy acid compound with respect to a content of the abrasive grains is 0.01 to 0.50.
2. The polishing liquid according to claim 1 , wherein the n11 in the General Formula (A1) is 0 or 1.
3. The polishing liquid according to claim 1 , wherein the n12 in the General Formula (A1) is 1.
4. The polishing liquid according to claim 1 , wherein the hydroxy acid compound contains at least one selected from the group consisting of glyceric acid, 2,2-bis(hydroxymethyl)propionic acid, 2,2-bis(hydroxymethyl)butyric acid, and hydroxyisobutyric acid.
5. The polishing liquid according to claim 1 , wherein a content of the hydroxy acid compound is 0.01 to 1.0% by mass.
6. The polishing liquid according to claim 1 , wherein the metal oxide contains cerium oxide.
7. The polishing liquid according to claim 1 , wherein a content of the abrasive grains is 0.10 to 3.0% by mass.
8. The polishing liquid according to claim 1 , further comprising an amino acid component.
9. The polishing liquid according to claim 8 , wherein the amino acid component contains glycine.
10. The polishing liquid according to claim 1 , wherein a pH is 1.0 to 7.0.
11. The polishing liquid according to claim 1 , wherein a pH is 3.0 to 5.0.
12. The polishing liquid according to claim 1 , further comprising an alkali component.
13. The polishing liquid according to claim 12 , wherein the alkali component contains aminothiazole.
14. The polishing liquid according to claim 12 , wherein the alkali component contains dimethylpyrazole.
15. The polishing liquid according to claim 1 , wherein the hydroxy acid compound contains at least one selected from the group consisting of glyceric acid, 2,2-bis(hydroxymethyl)propionic acid, 2,2-bis(hydroxymethyl)butyric acid, mandelic acid, and hydroxyisobutyric acid.
16. A polishing method comprising a step of polishing a material to be polished by using the polishing liquid according to claim 1 .
17. The polishing method according to claim 16 , wherein the material to be polished contains silicon oxide.
18. The polishing liquid according to claim 1 , wherein the hydroxy acid compound contains hydroxyisobutyric acid.
19. The polishing liquid according to claim 1 , wherein the hydroxy acid compound contains mandelic acid.