IP Library Assignment 058316/0522
Patent Assignment
Reel/Frame 058316/0522

Assignment of Assignor's Interest

Recorded: 2021-12-07 Pages: 6
Assignors
OTSUKA, YUYA
Executed: 2021-11-16
MINAMI, HISATAKA
Executed: 2021-09-13
KOBAYASHI, SHINGO
Executed: 2021-09-13
KOMINE, MAYUMI
Executed: 2021-10-11
TAKAHASHI, HISATO
Executed: 2021-09-15
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU,, TOKYO, 100-6606, JAPAN
Covered Property (1)
Polishing Solution and Polishing Method
Application: 17/438,808 →
Publication: US 2022/0251422
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →