IP Library Granted Patent US 12,637,600
Granted Patent B2
US 12,637,600 · App. 17/926,667 · Granted May 26, 2026

Photocurable composition, cured product of same, photofusible resin composition and adhesive set

Inventors: Yuki Miyamoto (Tokyo, JP); Masahito Watanabe (Tokyo, JP); Takashi Kumaki (Tokyo, JP)
Assignee: RESONAC CORPORATION
C09J181/02C08G75/045C09J4/00C09J11/06
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Quick Facts
Patent No.
US 12,637,600
App. No.
17/926,667
Granted
May 26, 2026
Kind
B2
Abstract

Disclosed is a photocurable composition containing a dithiol compound having a disulfide bond, a compound having two ethylenically unsaturated groups, a hydrogen abstraction type photoradical generator, and an intramolecular cleavage type photoradical generator.

Claims (28)

1 . A photocurable composition comprising:

a dithiol compound having a disulfide bond;

a compound having two ethylenically unsaturated groups;

a hydrogen abstraction type photoradical generator; and

an intramolecular cleavage type photoradical generator,

wherein the compound having two ethylenically unsaturated groups is a compound having two allyl groups or a compound having two vinyloxy groups.

2 . The photocurable composition according to claim 1 , wherein the hydrogen abstraction type photoradical generator has an absorption coefficient at a wavelength of 405 nm of 7 or more, and

the intramolecular cleavage type photoradical generator has an absorption coefficient at a wavelength of 405 nm of 5 or less and an absorption coefficient at a wavelength of 365 nm of 49 or more.

3 . The photocurable composition according to claim 1 , wherein the hydrogen abstraction type photoradical generator includes at least one selected from the group consisting of fluorenone and benzil.

4 . The photocurable composition according to claim 1 , wherein the intramolecular cleavage type photoradical generator includes one selected from the group consisting of 2,2-dimethoxy-1,2-diphenylethan-1-one and 2-hydroxy-2-methyl-1-phenylpropanone.

5 . The photocurable composition according to claim 1 , wherein the photocurable composition is used for an adhesive.

6 . A cured product of the photocurable composition according to claim 1 .

7 . A photofusible resin composition comprising:

a reaction product of a dithiol compound having a disulfide bond and a compound having two ethylenically unsaturated groups; and

an intramolecular cleavage type photoradical generator,

wherein the compound having two ethylenically unsaturated groups is a compound having two allyl groups or a compound having two vinyloxy groups.

8 . An adhesive set comprising:

a first component containing a dithiol compound having a disulfide bond;

a second component containing a compound having two ethylenically unsaturated groups, wherein

at least one of the first component and the second component further contains a hydrogen abstraction type photoradical generator, and

at least one of the first component and the second component further contains an intramolecular cleavage type photoradical generator,

wherein the compound having two ethylenically unsaturated groups is a compound having two allyl groups or a compound having two vinyloxy groups.

9 . The photocurable composition according to claim 1 , wherein the compound having two ethylenically unsaturated groups is a compound having two allyl groups.

10 . The photocurable composition according to claim 1 , wherein the compound having two ethylenically unsaturated groups is a compound having two vinyloxy groups.

11 . The photofusible resin composition according to claim 7 , wherein the compound having two ethylenically unsaturated groups is a compound having two allyl groups.

12 . The photofusible resin composition according to claim 7 , wherein the compound having two ethylenically unsaturated groups is a compound having two vinyloxy groups.

13 . The adhesive set according to claim 8 , wherein the compound having two ethylenically unsaturated groups is a compound having two allyl groups.

14 . The adhesive set according to claim 8 , wherein the compound having two ethylenically unsaturated groups is a compound having two vinyloxy groups.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 12, 2024
From: MIYAMOTO, YUKI; WATANABE, MASAHITO; KUMAKI, TAKASHI
To: RESONAC CORPORATION
Reel/Frame 066438/0178 →
CHANGE OF ADDRESS Recorded Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
CHANGE OF NAME Recorded Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Priority Claims (1)
JP 2020-173144 · Oct 14, 2020 · national
Continuity (1)
Related Publication 20230332026A1 · Oct 19, 2023
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