IP Library Assignment 066438/0178
Patent Assignment
Reel/Frame 066438/0178

Assignment of Assignor's Interest

Recorded: 2024-02-12 Pages: 2
Assignors
MIYAMOTO, YUKI
Executed: 2023-08-24
WATANABE, MASAHITO
Executed: 2023-08-25
KUMAKI, TAKASHI
Executed: 2023-08-25
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property (1)
Photocurable Composition, Cured Product of Same, Photofusible Resin Composition and Adhesive Set
Application: 17/926,667 →
Publication: US 2023/0332026
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →