Resin composition, heat storage material, and commodity

1. A resin composition comprising:

an acrylic resin; and

a curing agent,

wherein the acrylic resin is a resin obtained by polymerizing monomer components comprising a first monomer represented by the following formula (1):

wherein R 1 represents a hydrogen atom or a methyl group, and R 2 represents an alkyl group having 12 to 30 carbon atoms, and a second monomer copolymerizable with the first monomer and having a reactive group capable of reacting with the curing agent, wherein a content of the first monomer is 60 parts by mass or more based on 100 parts by mass of the monomer components, a content of the second monomer is 2 parts by mass or more and 25 parts by mass or less based on 100 parts by mass of the monomer components, and wherein a weight average molecular weight of the acrylic resin is 200000 or more.

2. A resin composition comprising:

an acrylic resin; and

a curing agent,

wherein the acrylic resin comprises a first structural unit represented by the following formula (2):

wherein R 3 represents a hydrogen atom or a methyl group, and R 4 represents an alkyl group having 12 to 30 carbon atoms, and a second structural unit having a reactive group capable of reacting with the curing agent, wherein a content of the first structural unit is 60 parts by mass or more based on 100 parts by mass of the entire structural units constituting the acrylic resin, a content of the second structural unit is 2 parts by mass or more and 25 parts by mass or less based on 100 parts by mass of the entire structural units constituting the acrylic resin, and wherein a weight average molecular weight of the acrylic resin is 200000 or more.

3. The resin composition according to claim 1 , wherein the curing agent is at least one curing agent selected from the group consisting of an isocyanate curing agent, a phenolic curing agent, an amine curing agent, an imidazole curing agent, and an acid anhydride curing agent.

4. The resin composition according to claim 1 , wherein the reactive group is at least one group selected from the group consisting of a carboxyl group, a hydroxyl group, an isocyanate group, an amino group, and an epoxy group.

5. The resin composition according to claim 1 , wherein a content of the acrylic resin is 50 parts by mass or more based on 100 parts by mass of the resin composition.

6. The resin composition according to claim 1 , wherein the reactive group is an epoxy group.

7. The resin composition according to claim 1 , wherein the resin composition is liquid at 90° C.

8. The resin composition according to claim 7 , wherein a viscosity at 90° C. is 100 Pa·s or less.

9. The resin composition according to claim 1 , wherein the resin composition is for use in forming a heat storage material.

10. The resin composition according to claim 1 , wherein the resin composition is for use in forming a water repellent material, a defrosting material, a refractive index adjusting material, a lubricant, an adsorbing material, a thermosetting stress relaxation material, or a low dielectric material.

11. A heat storage material comprising a cured product of the resin composition according to claim 1 .

12. An article comprising:

a heat source; and

a cured product of the resin composition according to claim 1 , the cured product provided to be in thermal contact with the heat source.

13. The resin composition according to claim 1 , wherein the content of the second monomer is 3 parts by mass or more and 25 parts by mass or less based on 100 parts by mass of the monomer components.

14. The resin composition according to claim 2 , wherein a content of the second structural unit is 3 parts by mass or more and 25 parts by mass or less based on 100 parts by mass of the entire structural units constituting the acrylic resin.