Conductor substrate, wiring substrate and method for producing wiring substrate

1. A conductor substrate comprising:

a stretchable resin layer containing a cured product of a resin composition containing (A) a rubber component comprising at least one kind of rubber selected from the group consisting of isoprene rubber, butyl rubber, styrene butadiene rubber, butadiene rubber, acrylonitrile butadiene rubber, silicone rubber, urethane rubber, chloroprene rubber, ethylene propylene rubber, fluororubber, sulfurized rubber, epichlorohydrin rubber, and chlorinated butyl rubber, and (B) a crosslinking component, wherein a content of (A) the rubber component is from 30% to 100% by mass with respect to 100% by mass of the stretchable resin layer; and

a conductor foil provided on the stretchable resin layer,

wherein a recovery factor after the stretchable resin layer is tensile-deformed to a strain of 20% is 80% or more.

2. The conductor substrate according to claim 1 , wherein an elastic modulus of the conductor foil is from 40 to 300 GPa.

3. The conductor substrate according to claim 1 , wherein (A) the rubber component contains rubber having a crosslinking group.

4. The conductor substrate according to claim 3 , wherein the crosslinking group is at least either of an acid anhydride group or a carboxyl group.

5. The conductor substrate according to claim 1 , wherein (B) the crosslinking component comprises a compound having at least one kind of reactive group selected from the group consisting of a (meth)acrylic group, a vinyl group, an epoxy group, a styryl group, an amino group, an isocyanurate group, a ureido group, a cyanate group, an isocyanate group, and a mercapto group.

6. The conductor substrate according to claim 1 , wherein the resin composition further contains (C) at least either of a curing agent or a curing accelerator.

7. The conductor substrate according to claim 1 , wherein the stretchable resin layer further contains an antioxidant.

8. A wiring substrate comprising:

the conductor substrate according to claim 1 ,

wherein the conductor foil forms a wiring pattern.

9. A stretchable device comprising:

the wiring substrate according to claim 8 ; and

an electronic element mounted on the wiring substrate.

10. A method for producing the wiring substrate according to claim 8 , comprising:

preparing a laminated sheet including the stretchable resin layer and the conductor foil laminated on the stretchable resin layer;

forming an etching resist on the conductor foil;

exposing the etching resist and developing the etching resist after being exposed to form a resist pattern covering a portion of the conductor foil;

removing a portion of the conductor foil which is not covered with the resist pattern; and

removing the resist pattern.

11. A conductor substrate comprising:

a stretchable resin layer containing a cured product of a resin composition containing (A) a rubber component comprising at least one kind of rubber selected from the group consisting of isoprene rubber, butyl rubber, styrene butadiene rubber, butadiene rubber, acrylonitrile butadiene rubber, silicone rubber, urethane rubber, chloroprene rubber, ethylene propylene rubber, fluororubber, sulfurized rubber, epichlorohydrin rubber, and chlorinated butyl rubber, and (B) a crosslinking component, wherein a content of (A) the rubber component is from 30% to 100% by mass with respect to 100% by mass of the stretchable resin layer; and

a conductor plating film provided on the stretchable resin layer,

wherein a recovery factor after the stretchable resin layer is tensile-deformed to a strain of 20% is 80% or more.

12. A wiring substrate comprising:

the conductor substrate according to claim 11 ,

wherein the conductor plating film forms a wiring pattern.

13. A method for producing the wiring substrate according to claim 12 , comprising:

forming a plating resist on the stretchable resin layer;

exposing the plating resist and developing the plating resist after being exposed to form a resist pattern covering a portion of the stretchable resin layer;

electrolessly plating the conductor plating film on a surface of a portion of the stretchable resin layer which is not covered with the resist pattern; and

removing the resist pattern.

14. A method for producing the wiring substrate according to claim 12 , comprising:

electrolessly plating the conductor plating film on the stretchable resin layer;

forming a plating resist on the conductor plating film formed by electroless plating;

exposing the plating resist and developing the plating resist after being exposed to form a resist pattern covering a portion of the stretchable resin layer;

electrolytically plating a conductor plating film on a portion of the conductor plating film formed by electroless plating which is not covered with the resist pattern;

removing the resist pattern; and

removing a portion of the conductor plating film formed by electroless plating not covered with the conductor plating film formed by electrolytic plating.

15. A method for producing the wiring substrate according to claim 12 , comprising:

forming an etching resist on the conductor plating film formed on the stretchable resin layer;

exposing the etching resist and developing the etching resist after being exposed to form a resist pattern covering a portion of the stretchable resin layer;

removing a portion of the conductor plating film not covered with the resist pattern; and

removing the resist pattern.

16. The conductor substrate according to claim 11 , wherein (B) the crosslinking component comprises a compound having at least one kind of reactive group selected from the group consisting of a (meth)acrylic group, a vinyl group, an epoxy group, a styryl group, an amino group, an isocyanurate group, a ureido group, a cyanate group, an isocyanate group, and a mercapto group.