Patent Assignment
Reel/Frame 052937/0368
Assignment of Assignor's Interest
Recorded: 2020-06-15
Pages: 4
Assignors
MASAKI, TAKESHI
Executed: 2019-05-08
SIM, TANGYII
Executed: 2019-05-08
YAMADA, KUMPEI
Executed: 2019-05-08
OGAWA, TADAHIRO
Executed: 2019-05-08
KAWAMORI, TAKASHI
Executed: 2019-05-08
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Conductor Substrate, Wiring Substrate and Method for Producing Wiring Substrate
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Sep 10, 2021
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 057462/0077 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →