IP Library Patent Application 17922867
Patent Application
App. No. 17/922,867

PHOTOSENSITIVE FILM, PHOTOSENSITIVE ELEMENT, AND METHOD FOR PRODUCING LAMINATE

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Patent No.
US None
App. No.
17/922,867
Abstract

A photosensitive film containing (A) a binder polymer, (B) a photopolymerizable compound, (C) a photopolymerization initiator, and (D) a pyrazoline compound, in which a thickness of the photosensitive film is 20 μm or less. A photosensitive element 1 including a support 2, and a photosensitive resin layer 3 disposed on the support 2, in which the photosensitive resin layer 3 is the photosensitive film. A method for producing a laminate, the method including a disposing step of disposing a photosensitive resin layer on a base material by using the above-described photosensitive film or the photosensitive element 1, a step of photo-curing a part of the photosensitive resin layer, and a step of removing at least a part of an uncured area of the photosensitive resin layer to form a cured product pattern.

Claims (30)

1 . A photosensitive film comprising: (A) a binder polymer; (B) a photopolymerizable compound; (C) a photopolymerization initiator; and (D) a pyrazoline compound, wherein

a thickness of the photosensitive film is 20 μm or less.

2 . The photosensitive film according to claim 1 , wherein the component (D) includes a compound having two or more aryl groups bonded to a pyrazoline ring.

3 . The photosensitive film according to claim 1 , wherein the component (D) includes a compound represented by General Formula (d1) below:

[in Formula (d1), R d11 , R d12 , and R d13 each independently represent an alkoxy group or an alkyl group, and d11, d12, and d13 each independently represent an integer of 0 to 5].

4 . The photosensitive film according to claim 1 , wherein a content of the component (D) is 0.10 to 1.0 part by mass with respect to 100 parts by mass of the total amount of the component (A) and the component (B).

5 . The photosensitive film according to claim 1 , wherein a content of the component (D) is 1.0 to 10 parts by mass with respect to 100 parts by mass of the total amount of the component (C) and the component (D).

6 . The photosensitive film according to claim 1 , wherein a content of a monomer unit of hydroxyalkyl (meth)acrylate in the component (A) is 0.10 to 5.0% by mass on the basis of the total amount of monomer units constituting the component (A).

7 . The photosensitive film according to claim 1 , wherein the component (A) has aryl (meth)acrylate and a styrene compound as monomer units.

8 . The photosensitive film according to claim 1 , wherein a content of a monomer unit of a styrene compound in the component (A) is 40% by mass or more on the basis of the total amount of monomer units constituting the component (A).

9 . The photosensitive film according to claim 1 , wherein a weight average molecular weight of the component (A) is 20000 to 50000.

10 . The photosensitive film according to claim 1 , wherein the component (B) includes a bisphenol A-type (meth)acrylic acid compound.

11 . The photosensitive film according to claim 10 , wherein a content of the bisphenol A-type (meth)acrylic acid compound is 30 parts by mass or more with respect to 100 parts by mass of the total amount of the component (A) and the component (B).

12 . The photosensitive film according to claim 1 , wherein the component (B) includes a (meth)acrylic acid compound having a polyoxyalkylene group.

13 . The photosensitive film according to claim 1 , wherein a content of the component (B) is 30 to 60 parts by mass with respect to 100 parts by mass of the total amount of the component (A) and the component (B).

14 . The photosensitive film according to claim 1 , further comprising a catechol compound.

15 . A photosensitive element comprising: a support; and a photosensitive resin layer disposed on the support, wherein

the photosensitive resin layer is the photosensitive film according to claim 1 .

16 . A method for producing a laminate, the method comprising:

a disposing step of disposing a photosensitive resin layer on a base material by using the photosensitive film according to claim 1 ;

a step of photo-curing a part of the photosensitive resin layer; and

a step of removing at least a part of an uncured area of the photosensitive resin layer to form a cured product pattern.

17 . The method for producing a laminate according to claim 16 , wherein the base material has a recessed portion having a diameter of 500 μm or less, and

at least a part of the photosensitive resin layer is disposed in the recessed portion in the disposing step.

18 . A method for producing a laminate, the method comprising:

a disposing step of disposing a photosensitive resin layer on a base material by using the photosensitive element according to claim 15 ;

a step of photo-curing a part of the photosensitive resin layer; and

a step of removing at least a part of an uncured area of the photosensitive resin layer to form a cured product pattern.

19 . The method for producing a laminate according to claim 18 , wherein the base material has a recessed portion having a diameter of 500 μm or less, and

at least a part of the photosensitive resin layer is disposed in the recessed portion in the disposing step.

Assignments (3)
CHANGE OF ADDRESS Recorded Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
CHANGE OF NAME Recorded Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 3, 2022
From: NARITA, MAO; ONO, KEISHI; TANAKA, SHIHO; TAKEDA, AKIKO; WATANABE, YUSAKU
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 061643/0077 →