IP Library Granted Patent US 11,342,303
Granted Patent B2
US 11,342,303 · App. 16/965,774 · Granted May 24, 2022

Member connection method and adhesive tape

Inventor: Tetsuyuki Shirakawa (Tokyo, JP)
Assignee: Showa Denko Materials Co., Ltd.
H01L24/83C09J7/38H01L24/29C09J2203/326H01L2224/2932H01L2224/29311H01L2224/29339H01L2224/29344H01L2224/29347H01L2224/29355H01L2224/29369H01L2224/29384H01L2224/29393H01L2224/83851
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Quick Facts
Patent No.
US 11,342,303
App. No.
16/965,774
Granted
May 24, 2022
Kind
B2
Abstract

This member connection method includes: a cutting step of forming cutting lines C in an adhesive layer at predetermined intervals at least in a width direction of an adhesive tape and making segments of the adhesive layer divided by the cutting lines C continuous at least in a lengthwise direction of the adhesive tape; a transfer step of disposing the segments to face a connection surface of one member to be connected, pressing a heating and pressing tool having an arbitrary pattern shape against the adhesive tape from a separator side and selectively transferring the segments to the one member to be connected; and a connection step for connecting another member to be connected to the one member to be connected via the segments transferred to the one member to be connected.

Claims (11)

1. A member connection method for connecting members to be connected using an adhesive tape having an adhesive layer provided on one surface side of a separator, comprising:

a cutting step of forming cutting lines in the adhesive layer at a predetermined interval at least in a width direction of the adhesive tape and making segments of the adhesive layer divided by the cutting lines continuous in a width direction and a lengthwise direction of the adhesive tape;

a transfer step of disposing the segments of the adhesive layer to face a connection surface of one member to be connected, pressing a heating and pressing tool having an arbitrary pattern shape against the adhesive tape from a separator side and selectively transferring the segments of the adhesive layer corresponding to a pressing portion of the heating and pressing tool to the one member to be connected; and

a connection step of connecting another member to be connected to the one member to be connected via the segments of the adhesive layer transferred to the one member to be connected.

2. The member connection method according to claim 1 , wherein, in the cutting step, the cutting lines are formed in the adhesive layer at predetermined intervals in the width direction and the lengthwise direction of the adhesive tape.

3. The member connection method according to claim 1 , wherein, in the cutting step, after the adhesive tape is delivered from a tape roll and the cutting lines are formed in the adhesive layer, the adhesive tape is wound to form a wound body.

4. The member connection method according to claim 1 , wherein the adhesive layer is provided on an entire surface of the separator on one surface side.

5. The member connection method according to claim 1 , wherein the cutting lines are formed to reach the one surface side of the separator from an adhesive layer side of the adhesive tape.

6. An adhesive tape having an adhesive layer provided on one surface side of a separator,

wherein cutting lines are formed in the adhesive layer at a predetermined interval at least in a width direction of the adhesive tape, and segments of the adhesive layer divided by the cutting lines are continuous in a width direction and a lengthwise direction of the adhesive tape.

7. The adhesive tape according to claim 6 , wherein the cutting lines are formed to reach the one surface side of the separator from an adhesive layer side of the adhesive tape.

Assignments (4)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
CHANGE OF NAME Recorded Jan 28, 2022
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 058894/0811 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 10, 2020
From: SHIRAKAWA, TETSUYUKI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 053441/0792 →