Polishing liquid, polishing liquid set and polishing method

1. A polishing liquid comprising: abrasive grains; a hydroxy acid component; a polyol component; at least one zwitterionic compound selected from the group consisting of an aminocarboxylic acid and an aminosulfonic acid; and a liquid medium, wherein

a zeta potential of the abrasive grains is positive,

the hydroxy acid component comprises a hydroxy acid having a quaternary carbon atom,

the polyol component comprises polyether polyol including a polyoxyalkylene group,

an isoelectric point of the aminocarboxylic acid is smaller than 7.0, and

pKa of the aminosulfonic acid is larger than 0.

2. The polishing liquid according to claim 1 , wherein the abrasive grains include a property of producing a liquid phase having an absorbance of more than 0 for light having a wavelength of 380 nm when an aqueous dispersion having a content of the abrasive grains adjusted to 1.0% by mass is subjected to centrifugal separation at a centrifugal acceleration of 5.8×10 4 G for five minutes.

3. The polishing liquid according to claim 1 , wherein the number of hydroxyl groups of the hydroxy acid is 2.

4. The polishing liquid according to claim 1 , wherein a content of the hydroxy acid component is 0.01 to 1.0% by mass.

5. The polishing liquid according to claim 1 , wherein the polyether polyol has the number of hydroxyl groups of 3 or more.

6. The polishing liquid according to claim 1 , wherein a content of the polyol component is 0.05 to 5.0% by mass.

7. The polishing liquid according to claim 1 , wherein the at least one zwitterionic compound comprises an aminocarboxylic acid.

8. The polishing liquid according to claim 1 , wherein the at least one zwitterionic compound comprises an aminosulfonic acid.

9. The polishing liquid according to claim 1 , wherein a content of the at least one zwitterionic compound is 0.01 to 1.0% by mass.

10. The polishing liquid according to claim 1 , wherein the hydroxy acid has-a carbon atom to which a plurality of hydroxyalkyl groups are bonded.

11. The polishing liquid according to claim 1 , wherein the hydroxy acid component comprises at least one selected from the group consisting of 2,2-bis(hydroxymethyl)propionic acid and 2,2-bis(hydroxymethyl)butyric acid.

12. The polishing liquid according to claim 1 , wherein the polyol component comprises at least one selected from the group consisting of a polyoxyalkylene trimethylolpropane ether and a pentaerythritol polyoxyalkylene ether.

13. A polishing liquid set comprising:

constituent components of the polishing liquid according to claim 1 , separately stored as a first liquid and a second liquid, wherein

the first liquid comprises the abrasive grains and the liquid medium, and

the second liquid comprises the hydroxy acid component, the polyol component, the at least one zwitterionic compound, and the liquid medium.

14. A polishing method comprising a polishing step of polishing a surface to be polished by using the polishing liquid according to claim 1 .

15. The polishing method according to claim 14 , wherein the surface to be polished comprises silicon oxide.

16. The polishing method according to claim 15 , wherein the surface to be polished further comprises silicon nitride, and

the silicon oxide is selectively polished with respect to the silicon nitride in the polishing step.

17. A polishing method comprising a polishing step of polishing a surface to be polished by using the polishing liquid obtained by mixing the first liquid and the second liquid of the polishing liquid set according to claim 13 .

18. The polishing method according to claim 17 , wherein the surface to be polished comprises silicon oxide.

19. The polishing method according to claim 18 , wherein the surface to be polished further comprises silicon nitride, and

the silicon oxide is selectively polished with respect to the silicon nitride in the polishing step.