Patent Assignment
Reel/Frame 031102/0375
Assignment of Assignor's Interest
Recorded: 2013-08-28
Pages: 3
Assignors
KOTAKE, TOMOHIKO
Executed: 2013-08-22
MIYATAKE, MASATO
Executed: 2013-08-22
NAGAI, SHUNSUKE
Executed: 2013-08-22
HASHIMOTO, SHINTARO
Executed: 2013-08-22
INOUE, YASUO
Executed: 2013-08-22
TAKANEZAWA, SHIN
Executed: 2013-08-22
MURAI, HIKARI
Executed: 2013-08-22
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 1630449, JAPAN
Covered Property
(1)
Modified Silicone Compound, and Thermosetting Resin Composition, Prepreg, Laminate Plate and Printed Wiring Board Using Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Apr 25, 2022
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 059790/0777 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →