Patent Assignment
Reel/Frame 059790/0777
Change of Name
Recorded: 2022-04-25
Pages: 52
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Modified Silicone Compound, and Thermosetting Resin Composition, Prepreg, Laminate Plate and Printed Wiring Board Using Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 28, 2013
From: KOTAKE, TOMOHIKO; MIYATAKE, MASATO; NAGAI, SHUNSUKE; HASHIMOTO, SHINTARO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 031102/0375 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →