Maleimide resin composition, prepreg, laminated board, resin film, multilayer printed wiring board, and semiconductor package
The present invention relates to a maleimide resin composition including (A) at least one selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof; and (B) a modified conjugated diene polymer, the component (B) being one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups and also to a prepreg, a laminate, a resin film, a multilayer printed wiring board, and a semiconductor package, each using the foregoing maleimide resin composition.
1. A maleimide resin composition comprising
(A) at least one selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a polyaminobismaleimide compound having a structural unit derived from the maleimide compound and a structural unit derived from a diamine compound; and
(B) a modified conjugated diene polymer,
the component (B) being one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups,
wherein a content ratio the component (A) to the component (B) [(A)/(B)] is 2.2 to 5.0 on a mass basis.
2. The maleimide resin composition according to claim 1 , wherein the component (B) has, in the side chain, a substituent (x) resulting from reaction between the vinyl group which the component (b1) has and the N-substituted maleimide group which the component (b2) has.
3. The maleimide resin composition according to claim 2 , wherein the substituent (x) is a group containing, as a structure derived from the component (b2), a structure represented by the following general formula (B-11) or (B-12):
wherein X B1 is a divalent organic group; * B1 is a site binding with the carbon atom derived from the vinyl group which the component (b1) has in the side chain; and * B2 is a site binding with other atom.
4. The maleimide resin composition according to claim 2 , wherein the component (B) has the substituent (x) and a vinyl group (y) in the side chain, and a ratio of the number of the substituent (x) relative to the total number of the substituent (x) and the substituent (y) contained in one molecule [x/(x+y)] is 0.01 to 0.5.
5. The maleimide resin composition according to claim 1 , wherein a number average molecular weight of the component (B) is 700 to 6,000.
6. The maleimide resin composition according to claim 1 , wherein the component (b1) is a polybutadiene having a 1,2-vinyl group.
7. The maleimide resin composition according to claim 6 , wherein the content of a structural unit having a 1,2-vinyl group is 50 mol % or more relative to the total structural units derived from butadiene constituting the polybutadiene having a 1,2-vinyl group.
8. The maleimide resin composition according to claim 1 , wherein the component (b2) is an aromatic bismaleimide compound substituted with an aliphatic hydrocarbon group.
9. The maleimide resin composition according to claim 1 , wherein a content ratio of the component (A) to the component (B) [(A)/(B)] is 2.2 to 3.5 on a mass basis.
10. A prepreg comprising the maleimide resin composition according to claim 1 or a semi-cured product of the maleimide resin composition.
11. A laminate comprising a cured product of the prepreg according to claim 10 and a metal foil.
12. A resin film comprising the maleimide resin composition according to claim 1 or a semi-cured product of the maleimide resin composition.
13. A multilayer printed wiring board comprising a cured product of the prepreg according to claim 10 .
14. A semiconductor package comprising a semiconductor device having the multilayer printed wiring board according to claim 13 mounted thereon.
15. A method for producing the maleimide resin composition according to claim 1 , the method comprising the following steps 1 and 2:
Step 1: a step of allowing (b1) a conjugated diene polymer having a vinyl group in the side chain and (b2) a maleimide compound having two or more N-substituted maleimide groups to react with each other, to obtain (B) a modified conjugated diene polymer; and
Step 2: a step of mixing (A) at least one selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof with the modified conjugated diene polymer (B).
16. A multilayer printed wiring board comprising the laminate according to claim 11 .
17. A semiconductor package comprising a semiconductor device having the multilayer printed wiring board according to claim 16 mounted thereon.
18. A multilayer printed wiring board comprising a cured product of the resin film according to claim 12 .
19. A semiconductor package comprising a semiconductor device having the multilayer printed wiring board according to claim 18 mounted thereon.