Patent Assignment
Reel/Frame 070346/0562
Assignment of Assignor's Interest
Recorded: 2025-02-27
Pages: 14
Assignors
KASAHARA, AYA
Executed: 2021-11-13
KOTAKE, TOMOHIKO
Executed: 2021-11-01
FUJIMOTO, DAISUKE
Executed: 2021-11-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Maleimide Resin Composition, Prepreg, Laminated Board, Resin Film, Multilayer Printed Wiring Board, and Semiconductor Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.