Adhesive composition
The present invention relates to an adhesive composition comprising an α-olefin homopolymer, an α-olefin copolymer having a melting point of 90° C. or higher, a tackifier resin, a wax, and a liquid softener, wherein a complex shear modulus (I) measured immediately after heating the adhesive composition to 180° C. and cooling the same to 20° C. is 1 MPa or less.
1. An adhesive composition comprising:
an α-olefin homopolymer containing a 1-butene homopolymer;
an α-olefin copolymer having a melting point of 90° C. or higher;
a tackifier resin;
a wax; and
a liquid softener,
wherein a complex shear modulus (I) measured immediately after heating the adhesive composition to 180° C. and cooling the same to 20° C. is 1 MPa or less.
2. The adhesive composition according to claim 1 , wherein the α-olefin copolymer contains at least one of a 1-butene/α-olefin copolymer and a propylene/α-olefin copolymer.
3. The adhesive composition according to claim 1 , wherein the tackifier resin contains at least one selected from the group consisting of a terpene phenol resin, a hydrogenated terpene resin, and a hydrogenated petroleum resin.
4. The adhesive composition according to claim 1 , wherein the wax contains a polypropylene-based wax.
5. The adhesive composition according to claim 1 having a melt viscosity of 100 Pas or less at 180° C.
6. The adhesive composition according to claim 1 , wherein a peeling length is 10 mm or less when performing a thermal creep resistance test with a load of 100 g for 24 hours in an atmosphere of 80° C. after bonding adherends via the adhesive composition with an open time of 45 seconds.