Multilayer printed wiring board production method, adhesive layer-equipped metal foil, metal-clad laminate, and multilayer printed wiring board
Disclosed is a production method of a multi-layered printed wiring board, including the following steps 1 to 3: Step 1: a step of laminating, on a substrate with inner layer circuit, a metal foil with adhesive layer including a support, a metal foil having a thickness of 3 μm or less and ⅙ or less relative to the thickness of the inner layer circuit, and an organic adhesive layer having a thickness of 10 μm or less in this order, via an organic insulating resin layer such that the organic insulating resin layer and the organic adhesive layer are opposed to each other, and then releasing the support to form a laminated sheet (a) having the metal foil as an outer layer metal foil layer; Step 2: a step of irradiating the laminated sheet (a) with a laser to bore the outer layer metal foil layer, the organic adhesive layer, and the organic insulating resin layer to form a bored laminated sheet (b) having a blind via hole; and Step 3: a step of forming an outer layer circuit connected with the inner layer circuit through the following steps 3-1 to 3-4: Step 3-1: a step of etching removing the outer layer metal foil layer of the bored laminated sheet (b) formed in the step 2 and then forming an outer layer copper layer having a thickness of 2 μm or less on the bored laminated sheet (b); Step 3-2: a step of forming a resist pattern by a resist applied on the outer layer copper layer; Step 3-3: a step of forming a circuit layer on the surface of the outer layer copper layer on which the resist pattern is not formed, by electrolytic copper plating; and Step 3-4: a step of removing the resist pattern and then removing the exposed outer layer copper layer by etching, thereby forming an outer layer circuit connected with the inner layer circuit.
1. A method of producing a multi-layered printed wiring board, comprising the following steps 1 to 3:
Step 1: a step of laminating a multilayer structure comprising, in order, a support, a metal foil and an organic adhesive layer, on a substrate with an inner layer circuit via an organic insulating resin layer, with the organic insulating resin layer being provided between the organic adhesive layer and the substrate with an inner layer circuit, the inner layer circuit having a thickness of 10 to 30 μm, the metal foil having a thickness of 3 μm or less and 1/10 to ⅙ relative to the thickness of the inner layer circuit, and the organic adhesive layer having a thickness of 1 to 10 μm, and then releasing the support to form a laminated sheet (a) having the metal foil as an outer layer metal foil layer;
Step 2: a step of irradiating the laminated sheet (a) with a laser to bore the outer layer metal foil layer, the organic adhesive layer, and the organic insulating resin layer to form a bored laminated sheet (b) having a blind via hole; and
Step 3: a step of forming an outer layer circuit connected with the inner layer circuit through the following steps 3-1 to 3-4;
Step 3-1: a step of removing the outer layer metal foil layer of the bored laminated sheet (b) formed in the step 2 by etching and then forming an outer layer copper layer having a thickness of 0.1 to 2 μm on the bored laminated sheet (b);
Step 3-2: a step of forming a resist pattern by a resist applied on the outer layer copper layer;
Step 3-3: a step of forming a circuit layer on the surface of the outer layer copper layer on which the resist pattern is not formed, by electrolytic copper plating; and
Step 3-4: a step of removing the resist pattern and then removing the exposed outer layer copper layer by etching, thereby forming an outer layer circuit connected with the inner layer circuit.
2. The method of producing a multi-layered printed wiring board according to claim 1 , wherein a ten-point average surface roughness Rz of the surface of the metal foil on the side of the organic adhesive layer is 3.0 μm or less.
3. The method of producing a multi-layered printed wiring board according to claim 1 , wherein a thermosetting resin composition containing an epoxy resin, a polymer component, an epoxy resin curing agent, a curing accelerator, and an inorganic filler having a specific surface area of 20 m 2 /g or more, the content of the inorganic filler being 1 to 10 parts by mass based on 100 parts by mass of the epoxy resin, is used as the organic adhesive layer.