Patent Assignment
Reel/Frame 045324/0385
Assignment of Assignor's Interest
Recorded: 2018-03-23
Pages: 8
Assignors
ONOZEKI, HITOSHI
Executed: 2018-03-20
INOUE, TSUBASA
Executed: 2018-03-20
YAMAGISHI, KATSUJI
Executed: 2018-03-20
SHIMIZU, HIROSHI
Executed: 2018-03-20
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Multilayer Printed Wiring Board Production Method, Adhesive Layer-Equipped Metal Foil, Metal-Clad Laminate, and Multilayer Printed Wiring Board
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Dec 9, 2020
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 054655/0652 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →