Interlayer insulating film and method for producing same
Provided is an interlayer insulating film for a multi-layered printed wiring board, including a wiring embedding layer (A) obtained by forming a thermosetting resin composition (I) into a layer, and an adhesion assisting layer (B) obtained by forming a thermosetting resin composition (II) into a layer, in which the interlayer insulating film contains a residual solvent in an amount of 1% to 10% by mass in a total amount of the wiring embedding layer (A) and the adhesion assisting layer (B), and the residual solvent contains an organic solvent having a boiling point of 150° C. to 230° C. in an amount of 10% by mass or more in a total amount of the residual solvent.
1. An interlayer insulating film for a multi-layered printed wiring board, comprising:
a wiring embedding layer (A) obtained by forming a thermosetting resin composition (I) into a layer; and
an adhesion assisting layer (B) obtained by forming a thermosetting resin composition (II) into a layer,
wherein the interlayer insulating film contains a residual solvent in an amount of 1% to 10% by mass in a total amount of the wiring embedding layer (A) and the adhesion assisting layer (B), and the residual solvent contains an organic solvent having a boiling point of 160° C. to 230° C. in an amount of from 30% to 64% by mass in a total amount of the residual solvent.
2. The interlayer insulating film for a multi-layered printed wiring board according to claim 1 , further comprising a support film (C),
wherein the interlayer insulating film comprises the wiring embedding layer (A), the adhesion assisting layer (B), and the support film (C) in this order.
3. The interlayer insulating film for a multi-layered printed wiring board according to claim 1 ,
wherein the lowest melt viscosity at 60° C. to 140° C. of the wiring embedding layer (A) and the adhesion assisting layer (B) is from 5 to 2,000 Pa·s.
4. The interlayer insulating film for a multi-layered printed wiring board according to claim 1 ,
wherein the thermosetting resin composition (I) contains an inorganic filler (d), and the content of the inorganic filler (d) in the thermosetting resin composition (I) is from 40 to 85 parts by mass with respect to 100 parts by mass of the solid content of the thermosetting resin composition (I).
5. The interlayer insulating film for a multi-layered printed wiring board according to claim 1 ,
wherein the thermosetting resin composition (I) contains an epoxy resin (a), and the content of the epoxy resin (a) in the thermosetting resin composition (I) is from 20 to 90 parts by mass with respect to 100 parts by mass of the solid content of the thermosetting resin composition (I) excluding the inorganic filler (d).
6. The interlayer insulating film for a multi-layered printed wiring board according to claim 5 ,
wherein the thermosetting resin composition (I) contains an epoxy resin having a softening point of 40° C. or higher as the epoxy resin (a).
7. The interlayer insulating film for a multi-layered printed wiring board according to claim 1 ,
wherein the thermosetting resin composition (II) contains an inorganic filler (d′), and the content of the inorganic filler (d′) in the thermosetting resin composition (II) is from 1 to 40 parts by mass with respect to 100 parts by mass of the solid content of the thermosetting resin composition (II).
8. The interlayer insulating film for a multi-layered printed wiring board according to claim 1 ,
wherein the thermosetting resin composition (II) contains an epoxy resin (a′), and the content of the epoxy resin (a′) in the thermosetting resin composition (II) is from 30 to 90 parts by mass with respect to 100 parts by mass of the solid content of the thermosetting resin composition (II) excluding the inorganic filler (d′).
9. The interlayer insulating film for a multi-layered printed wiring board according to claim 8 ,
wherein the thermosetting resin composition (II) contains an epoxy resin having a softening point of 40° C. or higher as the epoxy resin (a′).
10. The interlayer insulating film for a multi-layered printed wiring board according to claim 1 ,
wherein the thermosetting resin composition (II) contains a heat-resistant resin (f′), and the heat-resistant resin (f′) is at least one selected from the group consisting of a polyamide resin, a polyimide resin, and a polyamideimide resin.
11. The interlayer insulating film for a multi-layered printed wiring board according to claim 10 ,
wherein the content of the heat-resistant resin (f′) in the thermosetting resin composition (II) is from 1 to 30 parts by mass with respect to 100 parts by mass of the solid content of the thermosetting resin composition (II) excluding the inorganic filler (d′).
12. The interlayer insulating film for a multi-layered printed wiring board according to claim 1 ,
wherein the thickness of the wiring embedding layer (A) is from 5 to 60 μm, and the thickness of the adhesion assisting layer (B) is from 1 to 15 μm.
13. A method for producing the interlayer insulating film for a multi-layered printed wiring board according to claim 1 , comprising the following steps 1 and 2:
Step 1: a step of applying the thermosetting resin composition (II) onto a support film (C), followed by drying, to form the adhesion assisting layer (B); and
Step 2: a step of applying the thermosetting resin composition (I) onto the adhesion assisting layer (B), followed by drying, to form the wiring embedding layer (A).
14. The method for producing the interlayer insulating film for a multi-layered printed wiring board according to claim 13 ,
wherein the content of the residual solvent in the adhesion assisting layer (B) before performing the step 2 is 3% by mass or less based on the adhesion assisting layer (B).
15. The method for producing the interlayer insulating film for a multi-layered printed wiring board according to claim 13 ,
wherein a concentration of the solid content of the thermosetting resin composition (I) is from 50% to 85% by mass, and
the thermosetting resin composition (I) contains an organic solvent having a boiling point of 160° C. to 230° C., and the content of the organic solvent having a boiling point of 160° C. to 230° C. in the thermosetting resin composition (I) is from 5% to 50% by mass in the total organic solvent contained in the thermosetting resin composition (I).
16. The interlayer insulating film for a multi-layered printed wiring board according to claim 1 ,
wherein the interlayer insulating film contains the residual solvent in an amount of 2.5% to 6.5% by mass in the total amount of the wiring embedding layer (A) and the adhesion assisting layer (B).
17. The interlayer insulating film for a multi-layered printed wiring board according to claim 1 ,
wherein the interlayer insulating film contains the residual solvent in an amount of 6% by mass in the total amount of the wiring embedding layer (A) and the adhesion assisting layer (B).
18. The interlayer insulating film for a multi-layered printed wiring board according to claim 1 ,
wherein the residual solvent contains the organic solvent having a boiling point of 160° C. to 230° C. in an amount of from 40% to 60% by mass in a total amount of the residual solvent.
19. The interlayer insulating film for a multi-layered printed wiring board according to claim 1 ,
wherein the residual solvent contains the organic solvent having a boiling point of 160° C. to 230° C. in an amount of from 30% to 60% by mass in a total amount of the residual solvent.