Granted Patent
S1
US 999,179 · App. 29/834,581 · Granted Sep 19, 2023
Temporary protective film for manufacturing semiconductor devices
Assignee:
RESONAC CORPORATION
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Claims (1)
The ornamental design for a temporary protective film for manufacturing semiconductor devices, as shown and described.
Assignments (3)
CHANGE OF ADDRESS
Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME
Recorded Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Apr 13, 2022
From: TOMORI, NAOKI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 059582/0696 →