Photosensitive resin composition, photosensitive resin film, printed wiring board, semiconductor package, and method for producing printed wiring board
The present invention relates to provision of a photosensitive resin composition containing (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent, and (B) a photopolymerization initiator, wherein at least one of the components contained in the photosensitive resin composition is a component including a dicyclopentadiene structure; a photosensitive resin film using the foregoing photosensitive resin composition; a printed wiring board and a method for producing the same; and a semiconductor package.
1. A photosensitive resin composition comprising a plurality of components, the components comprising at least:
(A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent,
(B) a photopolymerization initiator,
(D) a thermosetting resin, and
(G) an elastomer, wherein
at least one of the components contained in the photosensitive resin composition is a component including a dicyclopentadiene structure, and
the thermosetting resin (D) comprises a tetramethyl biphenol type epoxy resin.
2. The photosensitive resin composition according to claim 1 , wherein the component including a dicyclopentadiene structure is one including a structure represented by the following general formula (X-1):
wherein R X1 and R X2 are each independently a divalent group having at least one group selected from the group consisting of an alkylene group, an arylene group, and an oxy group; and * is a binding site to other structure.
3. The photosensitive resin composition according to claim 1 , wherein a total mass of the dicyclopentadiene structure contained in the photosensitive resin composition is 5% by mass or more on the basis of the whole amount of the solid components of the components contained in the photosensitive resin composition.
4. The photosensitive resin composition according to claim 1 , wherein the photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent is an acid-modified ethylenically unsaturated group-containing epoxy derivative obtained by allowing (A′) a resin that is obtained through a reaction of (a) an epoxy resin and (b) an ethylenically unsaturated group-containing organic acid, to react with (c) a saturated group or unsaturated group-containing polybasic acid anhydride.
5. The photosensitive resin composition according to claim 4 , wherein the photopolymerizable compound (A) having an ethylenically unsaturated group and an acidic substituent contains
(A1) an acid-modified ethylenically unsaturated group-containing epoxy derivative that is obtained by using, as the epoxy resin (a), an epoxy resin having a dicyclopentadiene structure, and
(A2) an acid-modified ethylenically unsaturated group-containing epoxy derivative that is obtained by using, as the epoxy resin (a), at least one selected from the group consisting of a novolak type epoxy resin, a bisphenol type epoxy resin, and a triphenolmethane type epoxy resin.
6. The photosensitive resin composition according to claim 1 , wherein the photopolymerizable compound (A) having an ethylenically unsaturated group and an acidic substituent is one including a dicyclopentadiene structure.
7. The photosensitive resin composition according to claim 1 , further comprising (C) a photopolymerizable compound not having an acidic substituent.
8. The photosensitive resin composition according to claim 7 , wherein the photopolymerizable compound (C) not having an acidic substituent is a polyfunctional monomer having three or more ethylenically unsaturated groups.
9. The photosensitive resin composition according to claim 7 , wherein the photopolymerizable compound (C) not having an acidic substituent is one including a dicyclopentadiene structure.
10. The photosensitive resin composition according to claim 1 , further comprising (E) a pigment.
11. The photosensitive resin composition according to claim 1 , further comprising (F) an inorganic filler.
12. A photosensitive resin composition for photo via formation, comprising the photosensitive resin composition according to claim 1 .
13. A photosensitive resin composition for interlayer insulating layer, comprising the photosensitive resin composition according to claim 1 .
14. A photosensitive resin film comprising the photosensitive resin composition according to claim 1 .
15. A printed wiring board comprising a surface protective film or an interlayer insulating layer that is formed by using the photosensitive resin film according to claim 14 .
16. A method for producing a printed wiring board, comprising a step of providing a photosensitive layer using the photosensitive resin film according to claim 14 on a substrate; a step of forming a resin pattern by using the photosensitive layer; and a step of curing the resin pattern to form at least one of a surface protective film and an interlayer insulating layer, in this order.
17. A printed wiring board comprising a surface protective film or an interlayer insulating layer that is formed by using the photosensitive resin composition according to claim 1 .
18. A semiconductor package comprising the printed wiring board according to claim 17 having a semiconductor element mounted thereon.
19. A method for producing a printed wiring board, comprising a step of providing a photosensitive layer using the photosensitive resin composition according to claim 1 on a substrate; a step of forming a resin pattern by using the photosensitive layer; and a step of curing the resin pattern to form at least one of a surface protective film and an interlayer insulating layer, in this order.