Patent Assignment
Reel/Frame 057518/0237
Assignment of Assignor's Interest
Recorded: 2021-09-17
Pages: 7
Assignors
NAKAMURA, AKIHIRO
Executed: 2021-07-12
TAKASE, YUJI
Executed: 2021-07-12
SAWAMOTO, HAYATO
Executed: 2021-07-12
SUZUKI, YOSHIKAZU
Executed: 2021-07-14
NOMOTO, SHUJI
Executed: 2021-07-27
OKADE, SHOTA
Executed: 2021-07-27
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Photosensitive Resin Composition, Photosensitive Resin Film, Printed Wiring Board, Semiconductor Package, and Method for Producing Printed Wiring Board
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.