Resin composition, prepreg, laminate, multilayer printed wiring board, and semiconductor package
The present invention relates to a resin composition containing a phosphate ester-based flame retardant (A) having an aromatic hydrocarbon group containing two or more aromatic ring structures and a polyphenylene ether derivative (B) having an ethylenically unsaturated bond-containing group at both ends.
1. A resin composition comprising:
a phosphate ester-based flame retardant (A) having an aromatic hydrocarbon group containing two or more aromatic ring structures, wherein the aromatic hydrocarbon group containing two or more aromatic ring structures is (a1) a divalent aromatic hydrocarbon group having two or more aromatic rings in which two of the two or more aromatic rings are linked via a single bond or a linking group having 5 or less carbon atoms or (a2) a divalent fused polycyclic aromatic hydrocarbon group containing two or more aromatic ring structures; and
a polyphenylene ether derivative (B) having an ethylenically unsaturated bond-containing group at both ends.
2. The resin composition according to claim 1 , wherein the component (A) is a compound represented by the following general formula (A-1):
wherein R a1 to R a4 each independently represent an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom, X a1 represents a divalent group represented by the following general formula (A-2) or a divalent fused polycyclic aromatic hydrocarbon group containing two or more aromatic ring structures, n a1 to n a4 each independently represent an integer of 0 to 5, and n a5 represents an integer of 1 to 5:
wherein R a5 and R a6 each independently represent an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom, X a2 represents an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, or a single bond, n a6 and n a7 each independently represent an integer of 0 to 4, and n a8 represents an integer of 1 to 3.
3. The resin composition according to claim 1 , wherein the resin composition has a content of phosphorus atoms derived from the component (A) of 0.2 to 5% by mass based on solid components in the resin composition except for an inorganic filler.
4. The resin composition according to claim 1 , wherein the ethylenically unsaturated bond-containing group of the component (B) is a (meth)acryloyl group.
5. The resin composition according to claim 1 , wherein the component (B) has a weight average molecular weight (Mw) of 500 to 7,000.
6. The resin composition according to claim 1 , further comprising at least one thermosetting resin (C) selected from the group consisting of an epoxy resin, a cyanate resin, and a maleimide compound.
7. The resin composition according to claim 6 , wherein the resin composition comprises the maleimide compound as the component (C), the maleimide compound being a modified maleimide compound having a structural unit derived from a maleimide compound (c1) having at least two or more N-substituted maleimide groups and a structural unit derived from an amine compound (c2) having a primary amino group.
8. The resin composition according to claim 7 , wherein the modified maleimide compound is a compound represented by the following general formula (C-2):
wherein X c1 and X c4 are each independently a divalent organic group.
9. The resin composition according to claim 1 , further comprising one or more selected from the group consisting of a styrene-based thermoplastic elastomer (D), a curing accelerator (E), and an inorganic filler (F).
10. A prepreg comprising the resin composition according to claim 1 and a sheet-shaped fiber-reinforced substrate.
11. A laminate comprising the prepreg according to claim 10 and a metal foil.
12. A multilayer printed wiring board comprising the prepreg according to claim 10 .
13. A semiconductor package comprising the multilayer printed wiring board according to claim 12 and a semiconductor device mounted on the multilayer printed wiring board.
14. A multilayer printed wiring board comprising the laminate according to claim 11 .
15. A semiconductor package comprising the multilayer printed wiring board according to claim 14 and a semiconductor device mounted on the multilayer printed wiring board.
16. A method of producing a laminate, the method comprising a step of curing with heat the resin composition according to claim 1 ,
the component (A) having a melting point of 50 to 250° C.,
the curing with heat being performed at a temperature of the melting point of the component (A) or higher,
the component (A) in the resin composition before curing with heat having a particle shape.