Patent Assignment
Reel/Frame 058041/0290
Assignment of Assignor's Interest
Recorded: 2021-11-08
Pages: 12
Assignors
TAKI, TAKAHIRO
Executed: 2021-10-20
EJIRI, TAKAKO
Executed: 2021-10-19
IWAKURA, TETSURO
Executed: 2021-10-12
UCHIMURA, KANA
Executed: 2021-10-14
FUJII, TOSHIKI
Executed: 2021-10-12
OMORI, YUKAKO
Executed: 2021-10-23
KATO, TETSUYA
Executed: 2021-10-12
FUJIOKA, OSAMU
Executed: 2021-10-15
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Resin Composition, Prepreg, Laminate, Multilayer Printed Wiring Board, and Semiconductor Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.