Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring board

1 . A photosensitive resin composition comprising:

a photopolymerizable compound (A) having an ethylenically unsaturated group;

a photopolymerization initiator (B); and

an inorganic filler (F), wherein

the photopolymerizable compound (A) having an ethylenically unsaturated group includes a photopolymerizable compound (A1) having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group, and the alicyclic structure is represented by the following general formula (a):

wherein, in the general formula (a), R A1 represents an alkyl group having 1 to 12 carbon atoms and may be substituted in any site in the alicyclic structure; m 1 is an integer of 0 to 6; and * is a binding site to another structure, and

the inorganic filler (F) includes an inorganic filler surface-treated with a coupling agent without at least one functional group selected from the group consisting of an amino group and a (meth)acryloyl group.

2 . The photosensitive resin composition according to claim 1 , wherein the coupling agent has a group including an alkoxy group.

3 . The photosensitive resin composition according to claim 1 , wherein an average particle size of the inorganic filler (F) is 0.01 to 5 μm.

4 . The photosensitive resin composition according to claim 1 , wherein the content of the inorganic filler (F) is 5 to 80% by mass based on the total solid content.

5 . The photosensitive resin composition according claim 1 , wherein the photopolymerizable compound (A) having an ethylenically unsaturated group further includes at least one selected from the group consisting of a monofunctional vinyl monomer (Ai) having one polymerizable ethylenically unsaturated group, a bifunctional vinyl monomer (Aii) having two polymerizable ethylenically unsaturated groups, and a polyfunctional vinyl monomer (Aiii) having at least three polymerizable ethylenically unsaturated groups.

6 . The photosensitive resin composition according to claim 1 , wherein in the photopolymerizable compound (A1) having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group, the alicyclic structure is an alicyclic structure having a ring-forming carbon number of 5 to 20.

7 . The photosensitive resin composition according to claim 1 , wherein in the photopolymerizable compound (A1) having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group, the alicyclic structure includes two or more rings.

8 . The photosensitive resin composition according to claim 1 , further containing a thermosetting resin (C).

9 . The photosensitive resin composition according to claim 1 , further comprising an elastomer (D).

10 . The photosensitive resin composition according to claim 9 , wherein the elastomer (D) includes at least one selected from the group consisting of a styrene-based elastomer, an olefin-based elastomer, a polyester-based elastomer, a urethane-based elastomer, a polyamide-based elastomer, an acrylic elastomer, and a silicone-based elastomer.

11 . The photosensitive resin composition according to claim 1 , wherein the content of the photopolymerizable compound (A) having an ethylenically unsaturated group is 0.1 to 60% by mass based on the total solid content of the photosensitive resin composition.

12 . A photosensitive resin composition for photo via formation, comprising the photosensitive resin composition according to claim 1 .

13 . A photosensitive resin composition for interlayer insulating layer, comprising the photosensitive resin composition according to claim 1 .

14 . A photosensitive resin film comprising the photosensitive resin composition according to claim 1 .

15 . A photosensitive resin film for interlayer insulating layer, comprising the photosensitive resin composition according to claim 1 .

16 . A multilayered printed wiring board comprising an interlayer insulating layer formed of the photosensitive resin composition according to claim 1 .

17 . A multilayered printed wiring board comprising an interlayer insulating layer formed of the photosensitive resin film according to claim 14 .

18 . A semiconductor package comprising the multilayered printed wiring board according claim 16 and a semiconductor element.

19 . A method for producing a multilayered printed wiring board, comprising the following (1) to (4):

(1) laminating the photosensitive resin film according to claim 14 on one surface or both surfaces of a circuit substrate;

(2) exposing and developing the photosensitive resin film laminated in the above (1), to form an interlayer insulating layer having a via;

(3) subjecting the via and the interlayer insulating layer to a roughening treatment; and

(4) forming a circuit pattern on the interlayer insulating layer.