Patent Assignment
Reel/Frame 060521/0833
Assignment of Assignor's Interest
Recorded: 2022-07-15
Pages: 10
Assignors
SAWAMOTO, HAYATO
Executed: 2022-06-29
NOMOTO, SHUJI
Executed: 2022-07-01
NAKAMURA, AKIHIRO
Executed: 2022-07-04
OTSUKA, KOHEI
Executed: 2022-07-04
AKIYAMA, YUYA
Executed: 2022-07-06
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Photosensitive Resin Composition, Photosensitive Resin Film, Multilayered Printed Wiring Board, Semiconductor Package, and Method for Producing Multilayered Printed Wiring Board
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.